Technical Data Sheet BERGQUIST LIQUIFORM TLF LF2000 BERGQUIST LIQUI-FORM 2000 January -2019 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF UNCURED MATERIAL Thermally Conductive, One-Part, Liquid Formable Material . Viscosity ,Capillary ,ASTM D2196,Pas : -1 Highshear, Shear Rate 300 s 110 Technology Silicone Viscosity ,Parallel Plate ,ASTM D4473 ,mPas (cP) : -1 Appearance Gray Low shear, Shear Rate 0.001s 20,000 Cure Pre-cure gel Density ,ASTM D792,g/cc 2.8 Application Thermal management, Shelf Life 25C ,months 6 TIM(Thermal Interface Material) Operating Temperature -60 to 200C TYPICAL PROPERTIES OF CURED MATERIAL Range Physical Properties UL Flammability Rating UL 94 V-0 Volumetric Expansion ,25 to 275C ,ASTM E228 600 modified,ppm/C FEATURES AND BENEFITS Electrical Properties Thermal Conductivity: 2.0W/m-K Dielectric Strength ,ASTM D149,V/mm 10,000 Applies very low force on components during assembly Dielectric Constant ,ASTM D150,1,000Hz 8.0 Low volumetric expansion 9 Volume Resistivity ,ASTM D257,ohm-meter 110 Excellent chemical and mechanical stability even at higher temperatures Outgassing Properties No curing required Total Mass Loss, % ,ASTM E595 0.53 Stable viscosity in storage and in the application Thermal Properties Thermal Conductivity ,ASTM D5470 ,W/(m-K) 2.0 BERGQUIST LIQUIFORM TLF LF2000 is a highthermal conductivity liquid formable material designed for demanding Thermal Performance vs. Pressure applications requiring a balance between dispensability, low 2 (1) Thermal Impedance ,ASTM D5470 ,C-in /W component stresses during assembly and ease of rework . 10 psi 0.13 BERGQUIST LIQUI FORM TLF LF2000 is a highly 25 psi 0.12 conformable shear- thinning material which requires no curing, 50 psi 0.12 mixing or refrigeration .Its unique formulation assures excellent thermal performance, low appliedstress and reliable long-term performance . (1) The ASTM D5470 test fixture was utilized. The recorded values include the interfacial thermal resistance. The values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied BERGQUIST LIQUIFORM TLF LF2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application . GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet, (SDS). TYPICAL APPLICATIONS Not for product specifications Bare dieto heat spreader lid The technical data contained herein are intended as reference Fillingvarious gaps between heat-generating devices to only. Please contact your local quality department for heat sink and housing assistance and recommendations on specifications for this Devices requiring low assembly pressure product. BGA,PGA, PPGA The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.TDS BERGQUIST LIQUIFORM TLF LF2000, January -2019 CONFIGURATIONS AVAILABLE Disclaimer Note: BERGQUIST LIQUIFORM TLF LF2000is supplied in: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our Cartridges 30cc,600cc knowledge and experience of the product as at the date of this TDS. The product Pail 5gallon can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended THAWING: applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the 1. Ifrefrigerated, allow container to reach room temperature information in the Technical Data Sheet or any other written or oral before use . recommendation(s) regarding the concerned product is excluded, except if 2. DO NOT open the container before contents reach 25C otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory temperature. Any moisture that collects on the thawed product liability law. container should be removed prior to opening the In case products are delivered by Henkel Belgium NV, Henkel Electronic container . Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: STORAGE In case Henkel would be nevertheless heldliable,on whatever legal ground, Henkels liability will in no event exceed the amount of the concerned delivery. Store product in the unopened container in a dry location. In case products are delivered by Henkel Colombiana, S.A.S.the following Storage information may be indicated on the product container disclaimer is applicable: labeling. The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our Optimal Storage: 5 to 25C for a 6 month shelf life,in sealed knowledge and experience of the product as at the date of this TDS. Henkel is, containers with moisture barrier packaging. therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own Conversions prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other (C x 1.8)+ 32 =F written or oral recommendation(s) regarding the concerned product is excluded, kV/mm x 25.4 =V/mil except ifotherwise explicitly agreed and except in relation to death or personal mm /25.4 =inches injury caused by our negligence and any liability under any applicable mandatory N x 0.225=lb/F product liability law. In case products are delivered by Henkel Corporation, Resin Technology N/mm x 5.71=lb/in Group, Inc., or Henkel Canada Corporation, the following disclaimer is psi x 145 =N/mm applicable: MPa =N/mm The data contained herein are furnished for information only and are believed to Nm x 8.851 = lbin be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to Nm x 0.738=lbft determine suitability for the user s purpose of any production methods mentioned Nmm x 0.142 =ozin herein and to adopt such precautions as may be advisable for the protection of mPas =cP property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. denotes a trademark registered in the U.S. Patent and Trademark Office. Reference 2 For the most direct access to local sales and technical support visit: www.henkel.com/electronics