Technical Data Sheet BERGQUIST SILPAD TSP 1600 Known as BERGQUIST SIL-PAD800 November -2018 PRODUCT DESCRIPTION TYPICAL PROPERTIES High Performance Insulator for Low-Pressure Applications . Physical Properties Hardness, Shore A,ASTM D2240 91 Technology Silicone Elongation ,45 to warp and fill,ASTM D412 ,% 20 Appearance Gold Tensile Strength ,ASTM D412 ,MPa 12 Reinforcement Carrier Fiberglass Flammability Rating, UL 94 V-0 Total Thickness ,ASTM 0.127 mm D374 Electrical Properties Application Thermal management, DielectricBreakdown Voltage ,ASTM D149,Vac 3,000 Thermally conductive adhesive DielectricConstant ,ASTM D150 1,000 Hz 6.0 Operating Temperature -60 to 180C 10 Volume Resistivity ,ASTM D257,ohm-meter 110 Range Thermal Properties Thermal Conductivity ,ASTM D5470,W/(m-K) 1.6 FEATURES AND BENEFITS 2 Thermal impedance: 0.45C-in /W 50 psi Thermal Performance vs. Pressure High value material TO-220 Thermal Performance ,C/W Smooth and highly compliant surface 10 psi 3.56 Electrically isolating 25 psi 3.01 TYPICAL APPLICATIONS 50 psi 2.45 100 psi 2.05 Power supplies 200 psi 1.74 Automotive electronics Motor controls 2 (1) Thermal Impedance ,ASTM D5470,C-in /W Power semiconductors 10 psi 0.92 25 psi 0.6 BERGQUIST SIL PAD TSP 1600 family of thermally conductive insulation materials is designed for applications 50 psi 0.45 requiring high thermal performance and electrical isolation . 100 psi 0.36 These applications also typically have low mounting pressures 200 psi 0.29 for component clamping . BERGQUIST SILPAD TSP 1600material combines a smooth I)The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal and highly compliant surface characteristic with high thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. conductivity . These features optimize the thermal resistance properties at low pressure . GENERAL INFORMATION Applications requiring low component clamping forces include For safe handling information on this product, consult the Safety discrete semiconductors (TO-220, TO-247 and TO-218) Data Sheet, (SDS). mounted with spring clips . Spring clips assist with quick assembly but apply a limited amount of force to the Not for product specifications semiconductor . The technical data contained herein are intended as reference only. Please contact your local quality department for The smooth surface texture of BERGQUIST SILPAD TSP assistance and recommendations on specifications for this 1600minimizes interfacial thermal resistance and maximizes product. thermal performance . CONFIGURATIONS AVAILABLE BERGQUIST SILPAD TSP 1600 are supplied in: Sheet form, roll form and die-cut parts With or without pressure- sensitive adhesiveTDS BERGQUIST SILPAD TSP 1600, November -2018 Conversions (C x 1.8)+ 32 =F kV/mm x 25.4 =V/mil mm /25.4 =inches N x 0.225=lb N/mm x 5.71=lb/in psi x 145 =N/mm MPa =N/mm Nm x 8.851 = lbin Nm x 0.738=lbft Nmm x 0.142 =ozin mPas =cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liability in respect ofthe information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legal ground, Henkels liability will in no event exceed the amount ofthe concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liability in respect ofthe information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to determine suitability for the user s purpose ofany production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and ofpersons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage: Except as otherwise noted Alltrademarks in this document are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S.and elsewhere. Reference 1 Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics