Intel I/O Expansion Modules for Intel Platforms based on Intel Xeon Processor E5- 4600/2600/2400 Product Families Hardware Specification Intel order number: G30021-004 Revision 1.4 April 2015 Intel Server Boards and Systems Revision History Intel I/O Expansion Modules for Intel Platforms HWS Revision History Date Revision Modifications Number March, 2011 0.5 Initial Release. August, 2011 0.9 Added the following sections: Section 2.4 Intel I350 Gb Ethernet Controller Section 3.4 Intel X540 10Gb Ethernet Controller Section 4.4 Intel 82599 10Gb Ethernet Controller Section 5.4 - ConnectX*-3 Single/Dual-Port Adapter Silicon with VPI Section 6 FDR InfiniBand* ConnectX*-3 I/O Module (AXX1FDRIOIOM) August, 2011 0.91 Added figures for port identification. January, 2012 1.0 Deleted Section 5 - QDR InfiniBand* ConnectX*-3 I/O Module, and added new section for Dual Port FDR InfiniBand* ConnectX*-3 I/O Module. November, 2012 1.1 Added AXX10GBTWLHW Updated Table 1 December, 2014 1.2 Added AXX10GBTWLHW2 March, 2015 1.3 Updated Table 1 April, 2015 1.4 Added AXX10GBTWLHW3 and AXX10GBTWLIOM3 Updated Table 1 Disclaimers Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, lifesaving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions markedreserve or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design. The Intel I/O Expansion Modules may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the property of others. Copyright Intel Corporation 2015. ii Revision 1.4 Intel order number: G30021-004