X-On Electronics has gained recognition as a prominent supplier of ISM43362-L36-U WiFi Modules - 802.11 across the USA, India, Europe, Australia, and various other global locations. ISM43362-L36-U WiFi Modules - 802.11 are a product manufactured by Inventek. We provide cost-effective solutions for WiFi Modules - 802.11, ensuring timely deliveries around the world.

ISM43362-L36-U Inventek

ISM43362-L36-U electronic component of Inventek
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Part No.ISM43362-L36-U
Manufacturer: Inventek
Category: WiFi Modules - 802.11
Description: WiFi Modules (802.11) 802.11 b/g/n WiFi Radio SiP with U.FL. Certified FCC/IC/CE
Datasheet: ISM43362-L36-U Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 250
Multiples : 250
250 : USD 10.288
500 : USD 10.0972
N/A

Obsolete
   
Manufacturer
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RoHS - XON
Icon ROHS
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Operating Supply Voltage
Supply Current Transmitting
Supply Current Receiving
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We are delighted to provide the ISM43362-L36-U from our WiFi Modules - 802.11 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ISM43362-L36-U and other electronic components in the WiFi Modules - 802.11 category and beyond.

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ISM43362-L36 Product Specification INVENTEK SYSTEMS ISM43362-L36 Wi-Fi SiP Module eS-WiFi 802.11 b/g/n Data Sheet DOC-DS-20079-1.1 Inventek Systems Page 1 ISM43362-L36 Product Specification Table of Contents 1 General Description ................................................................................................................ 3 2 Part Number Description ........................................................................................................ 4 3 General Features ..................................................................................................................... 4 4 Specifications .......................................................................................................................... 5 4.1 Module Architecture / Block Diagram ........................................................................... 5 5 Limitations .............................................................................................................................. 6 5.1 Regulatory Compliance .................................................................................................. 6 5.2 FCC and IC Users Manual Statements: ......................................................................... 6 5.3 Industry Canada Users Manual Statements: .................................................................. 8 6 Complementary Documentation ............................................................................................. 9 6.1 Inventek Systems ............................................................................................................ 9 6.2 Environmental Specifications ......................................................................................... 9 7 Electrical Specifications.......................................................................................................... 9 7.1 Recommended Operating Ratings .................................................................................. 9 8 Power Consumption .............................................................................................................. 10 9 Wi-Fi RF Specification ......................................................................................................... 10 9.1 RF Specification............................................................................................................ 10 9.2 802.11b Transmit .......................................................................................................... 12 9.3 802.11g Transmit .......................................................................................................... 13 9.4 802.11n Transmit .......................................................................................................... 13 9.5 802.11b Receiver .......................................................................................................... 14 9.6 802.11g Receiver ......................................................................................................... 14 9.7 802.11n Receiver .......................................................................................................... 15 10 Footprint ................................................................................................................................ 18 11 PCB Layout (Top View) ....................................................................................................... 19 12 Boot Sequence ...................................................................................................................... 20 13 Communications Interfaces .................................................................................................. 21 13.1 SDIO and gSPI CONFIGURATION ............................................................................ 21 13.2 SDIO Timing (Default Mode) ...................................................................................... 22 13.3 SDIO Timing (High Speed Mode) ................................................................................ 23 13.4 gSPI Interface Characteristics ....................................................................................... 24 13.5 PCB Etch Antenna Gain on the Evaluation Board ........................................................... 25 13. 6 Farfield Directivity........................................................................................................... 26 14................................................................................................................................................... 27 14.1 External Antenna Option .............................................................................................. 27 15 Product Compliance Considerations ..................................................................................... 28 16 Reflow Profile ....................................................................................................................... 29 17 Packaging Information .......................................................................................................... 30 17.1 MSL Level / Storage Condition .................................................................................... 30 17.2 Device baking requirements prior to assembly ............................................................. 31 Modules Assembly Instructions .............................................................................................. 31 18 Contact Information .............................................................................................................. 32 DOC-DS-20079-1.1 Inventek Systems Page 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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