CPC5002GSTR IXYS

CPC5002 Dual High-Speed Open-Drain Digital Optical Isolator INTEGRATED CIRCUITS DIVISION Features Description Dual Optical Isolator The CPC5002 is a dual high speed optical logic Buffers Two Independent Signals isolator with open-drain outputs providing 3750V of rms Power-Down to Hi-Z Doesn t Load Outputs galvanic isolation between the inputs and the outputs. Low-Power CMOS Reduces Supply Current Activating the input LED causes the open-drain output Output operates Over 2.7V < V < 5.5V to turn on, pulling the voltage of the external pullup DD LED Drive Current Only 1.5mA resistor towards ground. Utilizing CMOS technology High Speed: 10Mbaud Typical enables the output stages high-gain circuitry to 3750V Galvanic Isolation operate with a miserly power consumption of <5mW rms (typical) when operated with a 3.3V supply voltage Single 8-Pin DIP or Surface Mount Package and a low input LED drive current of 1.5mA. Flammability Rating UL 94 V-0 Applications Because optical isolators pass logic levels directly there is no internal state refresh clock to maintain a Test and Measurement non-changing input. Additionally, the CPC5002 will A/D and D/A Isolation always return the buffered signals to their proper value Power Converter Isolation after a transient interruption at either side. Medical Ground Loop Elimination 2 I C Bus Isolation Computer Bus Isolation Isolated Line Receiver Approvals Ordering Information UL 1577 File E76270 Part Descript io n CSAReport 70157867 TUV Certificate available on our website CPC5002G 8-Pin DIP (50 / Tube) CPC5002GS 8-Pin Surface Mount (50 / Tube) CPC5002GSTR 8-Pin Surface Mount Tape & Reel (1000 / Reel) Figure 1. CPC5002 Functional Block Diagram 1 8 A1 V DD LED 2 7 K1 OUT1 3 6 K2 OUT2 LED 4 5 A2 GND DS-CPC5002-R04 www.ixysic.com 1CPC5002 INTEGRATED CIRCUITS DIVISION 1. Specifications 3 1.1 Package Pinout 3 1.2 Pin Description . 3 1.3 Absolute Maximum Ratings . 3 1.4 ESD Rating . 3 1.5 Recommended Operating Conditions . 4 1.6 General Conditions . 4 1.7 Electrical Specifications 4 1.8 Thermal Characteristics 4 1.9 Switching Specifications . 5 1.10 Propagation Delay Test Circuit 5 1.11 Typical Switching Waveforms . 6 2. Performance Data* . 7 3. Functional Description . 8 3.1 Introduction . 8 3.2 Functional Description . 8 3.3 Output Drivers . 9 3.4 Power Supply Decoupling and Noise Reduction . 9 4. Circuit Examples 9 4.1 Inverting and Non-Inverting Configurations . 9 4.2 Application Example . 10 5. Manufacturing Information . 12 5.1 Moisture Sensitivity 12 5.2 ESD Sensitivity . 12 5.3 Soldering Profile . 12 5.4 Board Wash 12 5.5 Mechanical Information . 13 2 www.ixysic.com R04