CPC7601K IXYS

CPC7601 Low Charge Injection, 16-Channel High Voltage Analog Switch INTEGRATED CIRCUITS DIVISION Features Description Processed with BCDMOS on SOI (Silicon On The CPC7601 is a low charge injection 16-channel Insulator) high-voltage analog switch integrated circuit (IC) for Flexible High Voltage Supplies up to V -V =200V use in applications requiring high voltage switching. PP NN Control of the high voltage switching is via low voltage DC to 10MHz Analog Signal Frequency CMOS logic level inputs for direct connectivity to the 60dB Minimum Output-Off Isolation at 5MHz system controller. Low Quiescent Power Dissipation (< 1A typical) Low Output On-Resistance Switch manipulation is managed by a 16-bit serial to Adjustable High Voltage Supplies parallel shift register whose outputs are buffered and Surface Mount Package stored by a 16-bit transparent latch. Level shifters buffer the latch outputs and operate the high voltage Applications switches. Ultrasound Imaging Because the CPC7601 is capable of switching high Printers load voltages and has a flexible load voltage range, Industrial Controls and Measurement e.g. V /V : +40V/-160V or +100V/-100V, it is well PP NN Piezoelectric Transducer Drivers suited for many medical and industrial applications such as medical ultrasound imaging, printers, and Figure 1. Block Diagram industrial measurement equipment. SHIFT LEVEL Construction of the high voltage switches using IXYS LATCHES SWITCHES REGISTER SHIFTERS Integrated Circuits Division s reliable SOI BCDMOS V PP CLK process technology allows the switches to be L0 SW0 organized as solid state switches with direct gate D SR0 D IN LS0 LE drive. CL L1 SW1 Ordering Information SR1 D LS1 LE CL Part Number Description L2 SW2 SR2 D CPC7601K 48-Pin LQFP in Trays (250/Tray) LS2 LE CL CPC7601KTR 48-Pin LQFP Tape & Reel (2000/Reel) L3 SW3 SR3 D LS3 LE CL L4 SW4 SR4 D LS4 LE CL L5 SW5 SR5 D LS5 LE CL L6 SW6 SR6 D LS6 LE CL L15 SW15 SR15 D LS15 LE CL D OUT V CL NN LE Pb e3 DS-CPC7601-R02 www.ixysic.com 1CPC7601 INTEGRATED CIRCUITS DIVISION 1. Specifications 3 1.1 Package Pinout 3 1.2 Pin Description 3 1.3 Absolute Maximum Ratings . 4 1.4 Recommended Operating Conditions . 4 1.5 Electrical Characteristics . 5 2. Functional Description . 8 2.1 Truth Table . 9 3. Manufacturing Information 10 3.1 Moisture Sensitivity 10 3.2 ESD Sensitivity . 10 3.3 Reflow Profile 10 3.4 Board Wash 10 3.5 Mechanical Dimensions 11 3.6 Tape and Reel Specifications 11 2 www.ixysic.com R02