DVRFD631-375/475 IXYS

DVRFM631DF18N50 Development Board DVRFM631DF12N100 Development Board General Description The DVRFM631DF18N50 and DVRFM631DF12N100 development boards are general purpose circuit boards de- signed to simplify the evaluation of the IXZ631DF18N50 and IXZ631DF12N100 combination gate driver and MOSFET module and to provide a building block for power circuit development. While the circuit board is the same, either a 500 V or 1000 V MOSFET is available and is factory installed and fully tested. The board design allows the module to be mounted to a heat sink, and in doing so allows the board assembly to be used as a ground referenced, low-side power switch. Figures 1 and 2 are top and bottom side pictures of the development board. The low-level input signal SMB connector and companion test point are shown to the left. If no SMB cable is available then the test point can be used as an al- ternative input connection. Continuing to the right of the SMB connector is the GND or ground and Vcc supply voltage test points, open pad drain connection and open pad for general component mounting. GND test point Vcc test point Open pad Drain pad IN test point Figure 1 Top side of development board Drain pad Module Figure 2 Bottom side of development board DVRFM631DF18N50 Development Board DVRFM631DF12N100 Development Board Mounting Orientation If heat is expected to be generated in a high frequency application, then thermal grease can be applied to the bottom of the module and the board mounted to a heatsink. Figure 3 shows application of thermal grease and Fig- ure 4 shows mounting to a heatsink using the two mounting holes adjacent to the module. Avoid using too much thermal grease, maximum screw torque should not exceed 6 n-M to prevent flexing of the board. If corner holes are to be used to secure the board, spacers should be inserted between board and heatsink to prevent bending of the board. If heavy components are to be mounted on board, then spacers on the corners should be considered to sup- port additional weight. You do not want the board to bend enough to short out against the heatsink. Figure 3 Application of thermal grease Figure 4 Board mounted to heatsink** **Heatsink shown is not provided.