0896BM15A0032E Johanson

High Frequency Ceramic Solutions Sub-GHz Impedance Matched Balun + LPF integrated Passive Component P/N: 0896BM15A0032 for Microchip SAM R30 Detail Specification: 1/27/2017 Page 1 of 4 For the Full App Note and Layout Files, go to: www.johansontechnology.com/microchip General Specifications Part Number 0896BM15A0032 Frequency (MHz) 863 - 928 Unbalanced Impedance 50 Conjugate match to Balanced Differential Impedance Microchip (Atmel) SAM R30 Insertion Loss 1.5 dB Typ (1.7dB max.) 180 10 Phase Difference (deg.) Amplitude Difference 2.0 max. Return Loss (dB) 12dB Typ (9.5 min.) Power Capacity 1W max (CW) Qty/Reel (pcs) Attenuation Differential mode (dB): 4,000 Operating Temp. Range -40 - +85C 40 Typ. (30 min.) 1726-1856 MHz Storage Temp. Range -40 - +85C Recommended Storage 49 Typ. (40 min.) 2589-2784 MHz +5 - +35 C, Conditions of Unused Humidity 45-75% Product on T&R 46 Typ. (38 min.) 3452-3712 MHz Storage Period 18 months max. Do you need help selecting the best sub-GHz antenna for your application Send us a message at: www.johansontechnology.com/ask-a-question Part Number Explanation Bulk E.g. 0896BM15A0032S Suffix = S Packaging Style P/N Suffix T & R Suffix = E E.g. 0896BM15A0032E Termination Style 100% Tin Suffix = None E.g. 0896BM15A0032(E or S) Mechanical Dimensions Terminal Configuration p a Inches Millimeter No Function No Function 0.079 0.004 2.00 0.1 Unbalanced Port Balanced Port L 1 4 T W 0.049 0.004 1.25 0.1 2 GND 5 GND T 0.028 0.004 0.70 0.1 3 Balanced Port 6 GND b g 0.012 0.004 0.30 0.1 a b 0.008 0.004 0.20 0.1 0.012 +0.004/-0.008 0.30 +0.1/-0.2 c W g 0.014 0.004 0.35 0.1 0.026 0.002 0.65 0.05 p L c Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions. www.johansontechnology.com 4001 Calle Tecate Camarillo, CA 93012, USA TEL +1.805.389.1166 Ver 1.0 2017 Johanson Technology, Inc. All Rights ReservedHigh Frequency Ceramic Solutions Sub-GHz Impedance Matched Balun + LPF integrated Passive Component P/N: 0896BM15A0032 for Microchip SAM R30 Detail Specification: 1/27/2017 Page 2 of 4 Mounting Considerations 0.3 0.35 *Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. 1.0 Vias are important for proper GND harmonic Footprint 0.8 GND Vias ( 0.35/ 0.2) 2.0 Would you like us to provide the layout files of the Microchip chipset + 2450BM15A0032 Review your layout * for free Please go to this link to contact our RF team: www.johansontechnology.com/ask-a-question Applications Engineerin on the drop down question type Units in mm Do you need the layout/gerber files of the above Go to: www.johansontechnology.com/microchip or send us a message to review your layout at: