High Frequency Ceramic Solutions 2.4GHz High Rejection BPF with LGA-type terminations for P/N 2450BP14F0100 reduced effective footprint, EIA 0603 Detail Specification: 12/13/2021 Page 1 of 4 General Specifications Part Number 2450BP14F0100 Frequency (MHz) 2400 - 2500 Insertion loss (dB) 2.5 typ. (2.8 max.) Return Loss (dB) 10 min. Power Capacity (W) 1 max. (CW) Operating Temperature -40 to +85C Attenuation (dB) Reel Quantity 4,000 pcs 880 - 915 MHz 40 min. Recommended Solder Paste SAC 305 1710 - 1850 MHz 40 min. +5 to +35C Recommended Storage 1850 - 1910 MHz 40 min. Conditions for unused T&R Humidity 45 - 75% RH product 1920 - 1990 MHz 40 min. 18 months max. 2110 - 2170 MHz 25 min. *12 months in vacuum sealed bag and 1 week after 4800 - 5000 MHz 30 min. opened. Please keep unused parts in vacuum sealed bags 7200 - 7500 MHz 20 min. For more info like hadnling and soldering profile, go to: High Frequency Ceramic Solutions 2.4GHz High Rejection BPF with LGA-type terminations for P/N 2450BP14F0100 reduced effective footprint, EIA 0603 Detail Specification: 12/13/2021 Page 2 of 4 Mounting Pad Dimensions Units in mm Solder Resist Land GND Via ( 0.35, 0.2) *Transmission line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. Measurement Schematic Port 2 Port 1 Network Analyzer Port 1: Filter IN/OUT (50 )(50 ) Port 2: Filter IN/OUT I/O I/O GND Johanson Technology, Inc. reserves the right to make design changes without notice. All sales are subject to Johanson Technology, Inc. terms and conditions.