3.5x3.5 mm SMD CHIP LED LAMP Part Number: AA3535SEL1Z1S Hyper Orange ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Descriptions Features z The Hyper Orange device is made with TS AlGaInP z White SMD package, silicone resin. light emitting diode. z Low thermal resistance. z Electrostatic discharge and power surge could damage z Compatible with IR-reflow processes. the LEDs. z ESD protection. z It is recommended to use a wrist band or anti- z Package: 2000pcs / reel. electrostatic glove when handling the LEDs. z Moisture sensitivity level : level 2a. z All devices, equipments and machineries must be z RoHS compliant. electrically grounded. Applications z Signal and symbol luminaire for orientation. z Marker lights (e.g. steps, exit ways, etc). z Decorative and entertainment lighting. z Commercial and residential lighting. z Automotive interior lighting. Package Dimensions Recommended Soldering Pattern (Units : mm Tolerance: 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01 ) unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAJ4024 REV NO: V.10B DATE: AUG/10/2014 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.Liu ERP: 1201007945 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of 2 leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAJ4024 REV NO: V.10B DATE: AUG/10/2014 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.Liu ERP: 1201007945