AAAF5051-03 Kingbright

5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP Part Number: AAAF5051-03 Blue ATTENTION Reddish-Orange OBSERVE PRECAUTIONS Green FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z Chips can be controlled separately. The Blue source color devices are made with InGaN z Suitable for all SMT assembly and solder process. on Al2O3 substrate Light Emitting Diode. z Available on tape and reel. This devices are made with AlGaInP. z White SMD package, silicone resin. The Green source color devices are made with InGaN z Package: 500pcs / reel. on Al2O3 substrate Light Emitting Diode. z Moisture sensitivity level : level 3. Static electricity and surge damage the LEDS. z RoHS compliant. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15 0.006 unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAK2496 REV NO: V.5 DATE: APR/12/2011 PAGE: 1 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201005942 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame- ter of the nozzle should be as large as possible. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of 2 leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAK2496 REV NO: V.5 DATE: APR/12/2011 PAGE: 2 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1201005942