APGF1011SEEPBVGC-TT 1 x 1 x 0.2 mm Full-Color Surface Mount LED DESCRIPTIONS PACKAGE DIMENSIONS The Green source color devices are made with InGaN on SiC substrate Light Emitting Diode The Blue source color devices are made with InGaN on SiC substrate Light Emitting Diode The Hyper-Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded FEATURES 1.0 mm x 1.0 mm SMD LED, 0.2 mm thickness Low power consumption Package: 4000 pcs / reel Moisture sensitivity level: 3 Halogen-free RoHS compliant RECOMMENDED SOLDERING PATTERN APPLICATIONS (units : mm tolerance : 0.1) Backlight Status indicator Home and smart appliances Wearable and portable devices Healthcare applications ATTENTION Observe precautions for handling Electrostatic discharge sensitive devices Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004 ) unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE 2 1 Iv (mcd) 5mA Viewin g Angle Emitting Color Part Number Lens Type (Material) Min. Typ. 21/2 50 80 Green (InGaN) APGF1011SEEPBVGC-TT Water Clear Blue (InGaN) 10 23 150 Hyper Red 15 30 (AlGaInP) Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. Page 1 / 4 2021 Kingbright. All Rights Reserved. Spec No: DSAO4028 / 1203015039 Rev No: V.10B Date: 01/06/2021 APGF1011SEEPBVGC-TT ELECTRICAL / OPTICAL CHARACTERISTICS at T =25C A Value Parameter Symbol Emitting Color Unit Typ. Max. Green 518 Wavelength at Peak Emission I = 5mA Blue 461 - nm F peak Hyper Red 632 Green 527 1 Dominant Wavelength I = 5mA Blue 467 - nm F dom Hyper Red 624 Green 35 Spectral Bandwidth at 50% REL MAX Blue 22 - nm I = 5mA F Hyper Red 20 Green 100 Capacitance C Blue 110 - pF Hyper Red 25 Green 3 3.2 2 Forward Voltage I = 5mA V Blue 2.9 3.1 V F F Hyper Red 1.95 2.3 Green 50 Reverse Current (V = 5V) I Blue - 50 A R R Hyper Red 10 Green 0.05 Temperature Coefficient of peak TC Blue 0.04 - nm/C peak I = 5mA, -10C T 85C F Hyper Red 0.13 Green 0.03 Temperature Coefficient of dom TC Blue 0.03 - nm/C dom I = 5mA, -10C T 85C F Hyper Red 0.06 Green -3 Temperature Coefficient of V F TC Blue -3 - mV/C V I = 5mA, -10C T 85C F Hyper Red -1.9 Notes: 1. The dominant wavelength (d) above is the setup value of the sorting machine. (Tolerance d: 1nm. ) 2. Forward voltage: 0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at T =25C A Value Parameter Symbol Unit Green Blue Hyper Red 1 Power Dissipation P 35 mW D Reverse Voltage V 5 5 5 V R Junction Temperature T 125 125 115 C j Operating Temperature T -40 to +85 C op Storage Temperature T -40 to +100 C stg 2 DC Forward Current I 10 10 10 mA F 3 Peak Forward Current I 50 50 50 mA FM Electrostatic Discharge Threshold (HBM) 1000 1000 3000 V - 4 Thermal Resistance (Junction / Ambient) R 580 430 640 C/W th JA 4 Thermal Resistance (Junction / Solder point) R 440 330 500 C/W th JS Notes: 1. Within 35mW when multiple chips are lightened 2. The maximum ratings are valid for the case of lighting a single chip When two chips are lit at the same time, each chip should be driven at a current lower than 50% of the absolute maximum ratings When three chips are lit at the same time, each chip should be driven at a current lower than 30% of the absolute maximum ratings 3. Duty Cycle 1/20 , Pulse Width = 1ms. 2 4. R ,R Results from mounting on PC board FR4 (pad size 16 mm per pad). th JA th JS 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Page 2 / 4 2021 Kingbright. All Rights Reserved. Spec No: DSAO4028 / 1203015039 Rev No: V.10B Date: 01/06/2021