L-53LID-TNR2.54 Kingbright

Application Notes For Through-Hole LEDs Storage conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature 30C and relative humidity 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100C. 4. The LED leadframe surface is plated with silver. When the leadframe is stored under high-humidity environments, or exposed to certain chemical elements or gases, the surface may become discolored. Please maintain the cleanliness of the storage environment. 5. If the storage conditions do not meet specification standards, the component pins may become oxidized requiring re-plating and re-sorting before use. Suggest customers consume LEDs as soon as possible, and avoid long-term storage of large inventories. LED MOUNTING METHOD 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures.(Fig. 1) Correct mounting method Incorrect mounting method Note 1-3 : Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. Rev No: V18 2/26/2015 Page 1 www.kingbright.com Application Notes For Through-Hole LEDs 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. (Fig. 2) 3. Use stand-offs (Fig. 3) or spacers (Fig. 4) to securely position the LED above the PCB. LEAD FORMING PROCEDURES 1. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend. (Fig. 5 and 6) 2. Lead forming or bending must be performed before soldering, never during or after Soldering. 3. Do not stress the LED lens during lead-forming in order to prevent fractures in the epoxy lens and damage the internal structures. 4. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 7) 5. Do not bend the leads more than twice. (Fig. 8) Rev No: V18 2/26/2015 Page 2 www.kingbright.com