X-On Electronics has gained recognition as a prominent supplier of L-53P3C Phototransistors across the USA, India, Europe, Australia, and various other global locations. L-53P3C Phototransistors are a product manufactured by Kingbright. We provide cost-effective solutions for Phototransistors, ensuring timely deliveries around the world.

L-53P3C Kingbright

L-53P3C electronic component of Kingbright
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See Product Specifications
Part No.L-53P3C
Manufacturer: Kingbright
Category: Phototransistors
Description: Phototransistor; 5mm; ?p max:940nm; 30V; 30°; Lens: transparent
Datasheet: L-53P3C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 0.2464 ea
Line Total: USD 1.23 
Availability - 6994
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
6994
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 5
Multiples : 1
5 : USD 0.2464
30 : USD 0.1918
100 : USD 0.1526
124 : USD 0.1386
341 : USD 0.1302

   
Manufacturer
Product Category
Dark Current
Led Lens
Mounting
Type Of Photodetector
Wavelength Of Peak Sensitivity
Viewing Angle
Led Diameter
Collector-Emitter Voltage
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the L-53P3C from our Phototransistors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the L-53P3C and other electronic components in the Phototransistors category and beyond.

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Application Notes For Through-Hole LEDs Storage conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature 30C and relative humidity 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100C. 4. The LED leadframe surface is plated with silver. When the leadframe is stored under high-humidity environments, or exposed to certain chemical elements or gases, the surface may become discolored. Please maintain the cleanliness of the storage environment. 5. If the storage conditions do not meet specification standards, the component pins may become oxidized requiring re-plating and re-sorting before use. Suggest customers consume LEDs as soon as possible, and avoid long-term storage of large inventories. LED MOUNTING METHOD 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures.(Fig. 1) Correct mounting method Incorrect mounting method Note 1-3 : Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. Rev No: V18 2/26/2015 Page 1 www.kingbright.com Application Notes For Through-Hole LEDs 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. (Fig. 2) 3. Use stand-offs (Fig. 3) or spacers (Fig. 4) to securely position the LED above the PCB. LEAD FORMING PROCEDURES 1. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend. (Fig. 5 and 6) 2. Lead forming or bending must be performed before soldering, never during or after Soldering. 3. Do not stress the LED lens during lead-forming in order to prevent fractures in the epoxy lens and damage the internal structures. 4. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 7) 5. Do not bend the leads more than twice. (Fig. 8) Rev No: V18 2/26/2015 Page 2 www.kingbright.com

Tariff Desc

8541.40.00 54 No .Light emitting diodes (LED), LED displays, optocouplers, photosensitive transistors and diodes, infra-red and fibre optic emitters and detectors Free

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES (LED); MOUNTED PIEZO-ELECTRIC CRYSTALS:
KINGBRIGHT
Kingbright Company LLC
Kingbright Corp
Kingbright Corporation
KINGBRIGHT ELECTRONIC
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