Accu-P Thin-Film Technology THE IDEAL CAPACITOR THIN-FILM TECHNOLOGY The non-ideal characteristics of a real capacitor can be ignored at Thin-film technology is commonly used in producing low frequencies. Physical size imparts inductance to the capacitor semiconductor devices. In the last two decades, this technology and dielectric and metal electrodes result in resistive losses, but has developed tremendously, both in performance and in process these often are of negligible effect on the circuit. At the very high control. Todays techniques enable line definitions of below 1m, frequencies of radio communication (>100MHz) and satellite and the controlling of thickness of layers at 100 (10-2m). systems (>1GHz), these effects become important. Recognizing Applying this technology to the manufacture of capacitors has that a real capacitor will exhibit inductive and resistive impedances enabled the development of components where both electrical in addition to capacitance, the ideal capacitor for these high and physical properties can be tightly controlled. frequencies is an ultra low loss component which can be fully The thin-film production facilities at AVX consist of: characterized in all parameters with total repeatability from unit Class 1000 clean rooms, with working areas under laminar- to unit. flow hoods of class 100, (below 100 particles per cubic foot Until recently, most high frequency/microwave capacitors were larger than 0.5m). based on fired-ceramic (porcelain) technology. Layers of ceramic High vacuum metal deposition systems for high-purity dielectric material and metal alloy electrode paste are interleaved electrode construction. and then sintered in a high temperature oven. This technology Photolithography equipment for line definition down to exhibits component variability in dielectric quality (losses, dielectric 2.0m accuracy. constant and insulation resistance), variability in electrode Plasma-enhanced CVD for various dielectric depositions conductivity and variability in physical size (affecting inductance). (CVD=Chemical Vapor Deposition). An alternate thin-film technology has been developed which High accuracy, microprocessor-controlled dicing saws for virtually eliminates these variances. It is this technology which has chip separation. been fully incorporated into Accu-P and Accu-P to provide high High speed, high accuracy sorting to ensure strict tolerance frequency capacitors exhibiting truly ideal characteristics. adherence. The main features of Accu-P may be summarized as follows: High purity of electrodes for very low and repeatable ESR. Highly pure, low-K dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 40GHz. Very tight dimensional control for uniform inductance, unit to unit. Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for accurate. Orientation Marking Alumina (Al O ) 2 3 Electrode Seal (SiNO) Dielectric (SiO / SiNO) 2 Electrode Alumina (Al O ) 2 3 Terminations ACCU-P CAPACITOR STRUCTURE The Important Information/Disclaimer is incorporated in these specifications by reference and should be reviewed in full before placing any order. 2 012419 Accu-P Thin-Film Technology ACCU-P TECHNOLOGY APPLICATIONS Video Switching The use of very low-loss dielectric materials, silicon dioxide and Cellular Communications silicon oxynitride, in conjunction with highly conductive electrode CT2/PCN (Cordless Telephone/ Test & Measurements metals results in low ESR and high Q. These high-frequency Personal Comm. Networks) Filters characteristics change at a slower rate with increasing frequency Satellite TV VCOs than for ceramic microwave capacitors. Cable TV Matching Networks Because of the thin-film technology, the above-mentioned frequency GPS (Global Positioning Systems) RF Amplifiers characteristics are obtained without significant compromise of Vehicle Location Systems properties required for surface mounting. Vehicle Alarm Systems The main Accu-P properties are: APPROVALS Paging Internationally agreed sizes with excellent dimensional control. ISO 9001 Military Communications Ultra small size chip capacitors (01005) are available. Radar Systems Ultra tight capacitance tolerances. Low ESR at VHF, UHF and microwave frequencies. Enhanced RF power handling capablity. PERFORMANCE TESTING High stability with respect to time, temperature, frequency and voltage variation. ALL COMPONENTS COMPLY WITH AEC-Q200 STANDARD Nickel/solder-coated terminations to provide excellent AEC-Q200 Qualification: solderability and leach resistance. Created by the Automotive Electronics Council Specification defining stress test qualification for passive components ACCU-P FEATURES Testing: Accu-P meets the fast-growing demand for low-loss (high-Q) Key tests used to compare soft capacitors for use in surface mount technology especially for the termination to AEC-Q200 qualification: mobile communications market, such as cellular radio of 450 and Bend Test Temperature Cycle Test 900 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 *Detailed qualification package is available on request. GHz, low noise blocks at 11-12.5 GHz and for other VHF, UHF and microwave applications. Accu-P is currently unique in its ability to offer very low capacitance values (0.05pF) and very tight capacitance tolerances (0.01pF). The RF power handling capability of the Accu-P allows for its usage in both small signal and RF power applications. Thin Film Technology guarantees minimal batch to batch variability of parameters at high frequency. Inspection test and quality control procedures in accordance with ISO 9001, CECC, IECQ and USA MIL Standards yield products of the highest quality. Hand soldering Accu-P : Due to their construction utilizing relatively high thermal conductivity materials, Accu-Ps have become the preferred device in R & D labs and production environments where hand soldering is used. The Important Information/Disclaimer is incorporated in these specifications by reference and should be reviewed in full before placing any order. 3 012419