X-On Electronics has gained recognition as a prominent supplier of 0508ZC102MAT2V Multilayer Ceramic Capacitors MLCC - SMD/SMT across the USA, India, Europe, Australia, and various other global locations. 0508ZC102MAT2V Multilayer Ceramic Capacitors MLCC - SMD/SMT are a product manufactured by Kyocera AVX. We provide cost-effective solutions for Multilayer Ceramic Capacitors MLCC - SMD/SMT, ensuring timely deliveries around the world.

0508ZC102MAT2V Kyocera AVX

0508ZC102MAT2V electronic component of Kyocera AVX
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Part No.0508ZC102MAT2V
Manufacturer: Kyocera AVX
Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description: Multilayer Ceramic Capacitors MLCC - SMDSMT 10V 1000pF X7R 0508 20% Tol
Datasheet: 0508ZC102MAT2V Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
4000: USD 0.3047 ea
Line Total: USD 1218.8 
Availability - 0
MOQ: 4000  Multiples: 4000
Pack Size: 4000
Availability Price Quantity
0
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 4000
Multiples : 4000
4000 : USD 0.3047
8000 : USD 0.2921
24000 : USD 0.2887
48000 : USD 0.2829

   
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We are delighted to provide the 0508ZC102MAT2V from our Multilayer Ceramic Capacitors MLCC - SMD/SMT category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 0508ZC102MAT2V and other electronic components in the Multilayer Ceramic Capacitors MLCC - SMD/SMT category and beyond.

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Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network (PDN) The ESL of a capacitor determines the speed of energy transfer to a load. are becoming critical aspects of board level and semiconductor package The lower the ESL of a capacitor, the faster that energy can be transferred designs due to higher operating frequencies, larger power demands, and the to a load. Historically, there has been a tradeoff between energy storage ever shrinking lower and upper voltage limits around low operating voltages. (capacitance) and inductance (speed of energy delivery). Low ESL devices These power system challenges are coming from mainstream designs typically have low capacitance. Likewise, higher capacitance devices with operating frequencies of 300MHz or greater, modest ICs with power typically have higher ESLs. This tradeoff between ESL (speed of energy demand of 15 watts or more, and operating voltages below 3 volts. delivery) and capacitance (energy storage) drives the PDN design topology that places the fastest low ESL capacitors as close to the load as possible. The classic PDN topology is comprised of a series of capacitor stages. Low Inductance MLCCs are found on semiconductor packages and on Figure 1 is an example of this architecture with multiple capacitor stages. boards as close as possible to the load. An ideal capacitor can transfer all its stored energy to a load instantly. A real capacitor has parasitics that prevent instantaneous transfer of a capacitors stored energy. The true nature of a capacitor can be modeled as an RLC equivalent circuit. For most simulation purposes, it is possible to model the characteristics of a real capacitor with one capacitor, one resistor, and one inductor. The RLC values in this model are commonly referred to as equivalent series capacitance (ESC), equivalent series resistance (ESR), and equivalent series inductance (ESL). Slowest Capacitors Fastest Capacitors Semiconductor Product VR Bulk Board-Level Package-Level Die-Level Low Inductance Decoupling Capacitors Figure 1 Classic Power Delivery Network (PDN) Architecture LOW INDUCTANCE CHIP CAPACITORS INTERDIGITATED CAPACITORS The key physical characteristic determining equivalent series inductance The size of a current loop has the greatest impact on the ESL characteristics (ESL) of a capacitor is the size of the current loop it creates. The smaller of a surface mount capacitor. There is a secondary method for decreasing the current loop, the lower the ESL. A standard surface mount MLCC is the ESL of a capacitor. This secondary method uses adjacent opposing rectangular in shape with electrical terminations on its shorter sides. A current loops to reduce ESL. The InterDigitated Capacitor (IDC) utilizes Low Inductance Chip Capacitor (LICC) sometimes referred to as Reverse both primary and secondary methods of reducing inductance. The IDC Geometry Capacitor (RGC) has its terminations on the longer side of its architecture shrinks the distance between terminations to minimize the rectangular shape. current loop size, then further reduces inductance by creating adjacent opposing current loops. When the distance between terminations is reduced, the size of the current loop is reduced. Since the size of the current loop is the primary driver of An IDC is one single capacitor with an internal structure that has been inductance, an 0306 with a smaller current loop has significantly lower optimized for low ESL. Similar to standard MLCC versus LICCs, the ESL then an 0603. The reduction in ESL varies by EIA size, however, ESL is reduction in ESL varies by EIA case size. Typically, for the same EIA size, an typically reduced 60% or more with an LICC versus a standard MLCC. IDC delivers an ESL that is at least 80% lower than an MLCC. The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 75Low Inductance Capacitors Introduction LAND GRID ARRAY (LGA) CAPACITORS LOW INDUCTANCE CHIP ARRAYS (LICA) Land Grid Array (LGA) capacitors are based on the first Low ESL MLCC The LICA product family is the result of a joint development effort between technology created to specifically address the design needs of current day AVX and IBM to develop a high performance MLCC family of decoupling Power Delivery Networks (PDNs). This is the 3rd low inductance capacitor capacitors. LICA was introduced in the 1980s and remains the leading technology developed by AVX. LGA technology provides engineers with choice of designers in high performance semiconductor packages and high new options. The LGA internal structure and manufacturing technology reliability board level decoupling applications. eliminates the historic need for a device to be physically small to create LICA products are used in 99.999% uptime semiconductor package small current loops to minimize inductance. applications on both ceramic and organic substrates. The C4 solder The first family of LGA products are 2 terminal devices. A 2 terminal 0306 ball termination option is the perfect compliment to flip-chip packaging LGA delivers ESL performance that is equal to or better than an 0306 8 technology. Mainframe class CPUs, ultimate performance multi-chip terminal IDC. The 2 terminal 0805 LGA delivers ESL performance that modules, and communications systems that must have the reliability of 5 approaches the 0508 8 terminal IDC. New designs that would have used 8 9s use LICA . terminal IDCs are moving to 2 terminal LGAs because the layout is easier for LICA products with either Sn/Pb or Pb-free solder balls are used for a 2 terminal device and manufacturing yield is better for a 2 terminal LGA decoupling in high reliability military and aerospace applications. These versus an 8 terminal IDC. LICA devices are used for decoupling of large pin count FPGAs, ASICs, LGA technology is also used in a 4 terminal family of products that AVX is CPUs, and other high power ICs with low operating voltages. sampling and will formerly introduce in 2008. Beyond 2008, there are new When high reliability decoupling applications require the very lowest ESL multi-terminal LGA product families that will provide even more attractive capacitors, LICA products are the best option. options for PDN designers. 470 nF 0306 Impedance Comparison 1 0306 2T-LGA 0306 LICC 0306 8T-IDC 0603 MLCC 0.1 0.01 0.001 1 10 100 1000 Frequency (MHz) Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL). The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 76 Impedance (ohms)

Tariff Desc

8532.24.00 43 no --Ceramic dielectric, multilayer Free

ELECTRICAL CAPACITORS, FIXED, VARIABLE OR ADJUSTABLE (PRE-SET)
American Technical Ceramics (ATC)
American Technical Ceramics (ATC) / AVX
ATC
ATC / Kyocera AVX
ATC DIVERSIFIED ELECTRONICS
AVX
AVX Kyocera
AVX (FORMERLY KNOWN AS NICHICON)
AVX / Kyocera
AVX Connectors
AVX Corp/Kyocera Corp
AVX Corporation
AVX INTERCONNECT
ELCO / AVX
Ethertronics
Ethertronics / AVX
ethertronics / kyocera avx
Ethertronics Inc
Ethertronics Inc.
ETHERTRONICS/AVX
ETHERTRONICS/KYOCERA AVX
Kyocera
kyocera avx
KYOCERA AVX Components
Kyocera Electronic Components
Kyocera Industrial Ceramics Corporation
KYOCERA INTERNATIONAL, INC.
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