F0603C1R50FWTR Kyocera AVX

Accu-Guard II Low Current Miniature 0603 Size Thin-Film Fuses ACCU-GUARD TECHNOLOGY The new F0603G Accu-Guard II low current fuses is based on thin-film technology which allows precise control of the component electrical and physical characteristics that is not possible with standard fuse technologies. The Accu-Guard II Low Current series encompasses the lowest current ratings in a 0603 package and features LGA terminations. FEATURES APPLICATIONS ELECTRICAL SPECIFICATIONS Cellular Telephones Accurate current rating Operating temperature: -55C to +125C Two-Way Radios Fast acting Current carrying capacity: Computers -55C to -11C 107% of rating Standard 0603 chip size -10C to +60C 100% of rating Battery Chargers Color coded +61C to +100C 85% of rating Rechargeable Battery Packs Taped and reeled +101C to +125C 80% of rating Hard Disk Drives RoHS compliant Rated voltage: 32V PDAs UL Approval: E141069 Post-fusing resistance: >1M LCD Screens Digital and Video Cameras TERMINATION Instrumentation Nickel/Solder coating compatible with automatic soldering technolgies: relow wave sodering, vapor phase and manual. ELECTRICAL PARAMETERS 2 Current Resistance Voltage Drop Fusing Current Pre-Arc I t Color Part Number Rating @0.1 x I @I (within 5 sec) @10xI RATED RATED RATED Code 2 A (max.) mV (max.) A A -sec (typ) -6 F0603G0R05FNTR 0.050 3.4 250 0.125 2 x 10 Blue -6 F0603G0R06FNTR 0.062 2.5 280 0.155 2 x 10 Yellow -6 F0603G0R07FNTR 0.075 2.0 280 0.1875 4 x 10 Brown -6 F0603G0R10FNTR 0.100 2.4 300 0.250 7 x 10 Red -5 F0603G0R12FNTR 0.125 1.6 250 0.312 1 x 10 White -5 F0603G0R15FNTR 0.150 1.2 220 0.375 2 x 10 Green -5 F0603G0R20FNTR 0.200 0.8 210 0.500 4 x 10 Pink RECOMMEND PAD LAYOUT millimeters (inches) RECOMMEND PAD LAYOUT millimeters (inches) S A B L 1.60.1 (0.0630.004) W 0.810.1 (0.0630.004) H T 0.610.1 (0.0630.004) A 0.230.05 (0.0630.002) 1.1 B 0.660.05 (0.0630.002) T (0.043) S, H 0.100.05 (0.0630.002) L W 0.85 (0.033) 2.4 (0.095) Accu-Guard II Low Current Miniature 0603 Size Thin-Film Fuses ENVIRONMENTAL CHARACTERISTICS Test Conditions Requirement Solderability Components completely immersed in a Total area of imperfections in solder coating solder bath at 245 5C for 3 secs. up to 5% of the land suface area Leach Resistance Components completely immersed in a solder Dissolution of termination bath at 255 5C for 60 secs. 15% of the land surface area Storage 12 months minimum with components Good solderability stored in as received packaging. Shear Components mounted to a substrate. Destruction at 5N force minimum Increasing shearing force applied paralled to the sufstrate till destruction. Temperature Components mounted to a flexible substrate No Visible damage Cycling (e.g. FR 4). 1000 cycles -55C to +125C. R/R<10% Bend Tested as shown in diagram No visible damage R/R<10% 3 mm Deflection 45mm 45mm 2