QB2010A60WSS3 Kyocera AVX

ATC Q-BRIDGE THERMAL CONDUCTOR ATC Q-Bridge Thermal Conductor ATCs new Q-Bridge Thermal Conductor is manufactured with the highest quality materials for reliable and repeatable performance providing a cost effective thermal management solution. These devices are constructed with Aluminum Nitride (AlN) or Beryllium Oxide (BeO) and are available in standard EIA form factors. Q-Bridge provides the designer with the ability to manage thermal conditions by directing heat to a thermal ground plane, heat sink or any other specific thermal point of interest. The inherently low capacitance makes this device virtually transparent at RF / microwave frequencies. This device has the added benefit of offering Applications: additional layers of protection to adjacent components from hot spot thermal loads. GaN Power Amplifiers High RF Power Amplifiers Q-Bridge provides the benefit of increased overall circuit reliability. ATCs Q-Bridge is manufactured using one- Filters piece construction, providing a RoHS compliant SMT Synthesizers package that is fully compatible with high speed auto- Industrial Computers mated pick-and-place processing. It is available in various EIA case sizes. Custom configurations are also available. Switch Mode Power Supplies Pin & Laser Diodes Features: High Thermal Conductivity Functional Applications: Low Thermal Resistance Between active device and adjacent ground planes Low Capacitance Specific contact pad to case Increases Circuit Reliability Contact pad to contact pad RoHS Compliant Direct component contact to via pad or trace Edges fully metalized More efficient thermal management Termination Materials ATC Termination Code Termination Materials Y Silver Platinum Non-Magnetic Termination S Silver over Magnetic Termination Note: Non-edge wrapped style in all case sizes is supplied with S termination Edge wrapped style in case sizes 0302 through 1111 is supplied with Y termination Edge wrapped style in case sizes 2010 through 3737 are supplied with S termination ATC 001-1143 Rev. I, 4/20 THE ENGINEERS CHOICE www.atceramics.comATC Q-BRIDGE THERMAL CONDUCTOR Mechanical Configurations W W L L T T Wrapped Non-Wrapped Typical Characteristics Thermal Thermal Available Case Thickness Terminal Resistance (C/W) Conductivity (mW/C) Configurations Length (L) Width (W) Size (T) (t) AlN BeO AlN BeO Style Termination W Y .030 .002 .020 .002 20 10 0302 19 12 53 81 (.77 .051) (0.51 .051) (0.51 .05) (0.25) E S W Y .040 .002 .020 .002 20 10 0402 25 16 40 61 (1.02 .051) (0.51 .051) (0.51 .05) (0.25) E S W Y .050 .002 .050 .002 25 15 0505 10 7 100 153 (1.27 .051) (1.27 .051) (0.64 .05) (0.38) E S W Y .060 .002 .030 .002 25 15 0603 20 13 50 76 (1.52 .051) (.76 .051) (0.64 .05) (0.38) E S W Y .080 .002 .050 .002 40 20 0805 10 7 100 153 (2.03 .051) (1.27 .051) (1.02 .05) (0.51) E S W Y .100 .002 .050 .002 40 20 1005 13 8 77 122 (2.54 .051) (1.27 .051) (1.02 .05) (0.51) E S W Y .100 .002 .200 .002 40 20 1020 3 2 320 508 (2.54 .051) (5.08 .051) (1.02 .05) (0.51) E S W Y .110 .002 .110 .002 40 20 1111 7 4 153 240 (2.79 .051) (2.79 .051) (1.02 .05) (0.51) E S W S .195 .010 .095 .010 60 30 2010 10 6 100 159 (4.95 .254) (2.41 .254) (1.52 .05) (0.77) E S W S .240 .010 .250 .010 60 40 2525 4 3 240 380 (6.10 .254) (6.35 .254) (1.52 .05) (1.02) E S W S .370 .010 .245 .010 60 50 3725 6 4 160 254 (9.40 .254) (6.22 .254) (1.52 .05) (1.27) E S W S .365 .010 .375 .010 60 50 3737 4 3 240 380 (9.27 .254) (9.53 .254) (1.52 .05) (1.27) E S inches (mm) Note: Thermal conductivity is normalized to chip size. All values are approximate. Consult factory for extended thermal conductivity options. 2 THE ENGINEERS CHOICE www.atceramics.com t t