Bluetooth Audio Modules BTM510/511 Innovative Technology for a Connected World The BTM510 and BTM511 are low-power Bluetooth modules from Laird Technologies are designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power consumption with outstanding range. Supporting the latest Bluetooth Version 2.1+EDR specification, these modules provide the important advantage of secure simple pairing that improves security and enhances easy use. BTM510 and BTM511 modules now come standard with the apt-X audio codec for wireline quality stereo audio. The compact size of the modules makes them ideal for battery-powered or headset form factor audio and voice devices. With a 16-bit stereo codec and microphone inputs to support both stereo and mono applications, these modules also contain a fully, integrated Bluetooth-qualified stack along with SPP, HFP 1.5, HSP, AVRCP, DUN, and A2DP profiles. The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05. This allows designers to add significant product enhancements including features such as echo cancellation, noise reduction, and audio enhancement using additional soft codecs. BTM510 and BTM511 modules are provided with CSRs apt-X codec without additional license fees. CSRs world renowned apt-X audio compression solutions retain the full integrity of original digital audio and are optimized for instant real-time audio streaming ( Bluetooth Audio Modules BTM510/511 Innovative Technology for a Connected World CATEGORIES FEATURE IMPLEMENTATION Wireless Specification Bluetooth Version 2.1+EDR Frequency 2.402 2.480 GHz Class 2 Max Transmit Power 4 dBm (at antenna pad BTM510) 4 dBmi (from integrated antenna BTM511) Receive Sensitivity Better than -86 dBm Range 30 meters Data Rates Up to 3 Mbps (over the air) UART Data Transfer Rate Greater than 300 Kbps Host Interface UART Supports DTR, DSR, DCD and RI, multiplexed with other functionality. Internal 16 bit Stereo Codec Audio Interfaces Codec Integrated Amplifiers for driving Stereo Speaker I2S / PCM Master / Slave roles Microphone Stereo microphone input DSP Integrated Kalimba DSP 32-bit, 64 MIPS Additional I/O 4 x GPIO Function Mapping e.g. button control SPP Serial Port Profile HSP HFP Audio Gateway and Handset Profiles A2DP Source and Sink AVRCP Target and Controller DUN Supply Voltage Supply 3.0 V 3.6 V DC I/O 1.7 V 3.6 V DC Operational - Less than 70 mA (including speaker amplifiers) Power Consumption Current Consumption Idle (sleep) < 1.0 mA Coexistence / 802.11 (WLAN) 2 wire and 3 wire schemes supported Compatibility Connections External Antenna Connection via SMT pad BTM510 Internal Antenna Multilayer ceramic antenna BTM511 Programming API AT Command Set (extended for audio and headset functions) 14.0 mm x 20.0 mm x 3.4 mm (integrated antenna BTM510) Physical Dimensions 14.0 mm x 25.0 mm x 3.4 mm (integrated antenna BTM511) Environmental Operating Temperature -30C to +70C Storage Temperature -40C to +85C Miscellaneous Lead free Lead-free and RoHS compliant Warranty 1 Year Development Tools Development Kit Development board and software tools Approvals Bluetooth End Product Approved BTM510 - Limited Modular Approval FCC/IC & CE BTM511 - Full Modular Approval ORDERING INFORMATION BTM510 Bluetooth Multimedia Module (external antenna) BTM511 Bluetooth Multimedia Module (with integrated antenna) DVK- BTM510 Development Kit (external antenna) DVK- BTM511 Development Kit (with integrated antenna) The details contained within the document are subject to change. Download the product specification from www.lairdtech.com/wireless for the most current specification. LWS-DS-BTM510-511 0412 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.