Bluetooth Audio Modules BTM510/511 Firmware Release v22.2.5.0 The BTM510 and BTM511 low-power Bluetooth modules from Laird are designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power consumption with outstanding range. Supporting the latest Bluetooth Version v3.0 specification, these modules provide the important advantage of Simple Secure Pairing that improves security and enhances easy use. BTM510 and BTM511 modules come standard with the apt-X audio codec for wireline-quality stereo audio. The modules compact size makes them ideal for battery-powered headset form factor audio and voice devices. With a 16-bit stereo codec and microphone inputs to support stereo and mono applications, the modules contain a fully integrated Bluetooth-qualified stack along with SPP, HFP 1.6, HSP, AVRCP v1.5, and A2DP profiles. The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05. This allows designers to make use of features such as echo cancellation and noise reduction using CSR Clear Voice Capture (CVC) as well as A2DP audio enhancements using CSR Music Manager. BTM510 and BTM511 modules are provided with CSRs apt-X codec without additional license fees. CSRs world renowned apt-X audio compression solutions retain the full integrity of original digital audio and are optimized for instant real-time audio streaming ( Bluetooth Audio Modules BTM510/511 Firmware Release v22.2.5.0 CATEGORIES FEATURE IMPLEMENTATION Bluetooth Version 3.0 Frequency 2.402 2.480 GHz Class 2 - 4 dBm (at antenna pad BTM510) Max Transmit Power Wireless Specification 4 dBmi (from integrated antenna BTM511) Receive Sensitivity Better than -86 dBm Range Up to 30 meters Data Rates Up to 3 Mbps (over the air) UART Data Transfer Rate Greater than 300 Kbps Host Interface UART Supports DTR, DSR, DCD and RI, multiplexed with other functionality Internal 16-bit Stereo Codec Codec Integrated Amplifiers for driving stereo speaker Audio Interfaces I2S / PCM Master / slave roles Microphone Stereo microphone input DSP Integrated Kalimba DSP 32-bit, 64 MIPS Additional I/O 4 x GPIO Function Mapping e.g. button control SPP (Serial Port Profile), HSP, HFP v1.6 (Audio Gateway and Handset), A2DP Profiles (Source and Sink), AVRCP v1.5 (Target and Controller) Supply 3.0 V to +3.6 V DC Supply Voltage I/O 1.7 V to +3.6 V DC Operational - Less than 70 mA (including speaker amplifiers) Power Consumption Current Consumption Idle (sleep) < 1.0 mA Configurable Sniff mode and Sniff sub rating Coexistence 802.11 (WLAN) 2 wire and 3 wire schemes supported External Antenna Connection via SMT pad BTM510 Connections Internal Antenna Multilayer ceramic BTM511 Programming API AT Command Set (extended for audio and headset functions) 14 mm x 20 mm x 3.4 mm (SMT connector BTM510) Physical Dimensions 14 mm x 25 mm x 3.4 mm (integrated antenna BTM511) Operating Temperature -40 C to +85 C Environmental Storage Temperature -40 C to +85 C Lead Free Lead-free and RoHS compliant Miscellaneous Warranty 1-Year Warranty Developmental Tools Development Kit Development board and software tools Bluetooth End Product Approved Approvals BTM510 - Limited Modular Approval FCC/IC/CE & MIC BTM511 - Full Modular Approval Ordering Information BTM510-09 Bluetooth Multimedia Module (external antenna) BTM511-09 Bluetooth Multimedia Module (with internal antenna) DVK-BTM510 Development Kit (external antenna) DVK-BTM511 Development Kit (with internal antenna) The details contained within the document are subject to change. Download the product specification from www.lairdtech.com/wireless for the most current specification. CONN-DS-BTm510/511 FW v22.2.5.0 Revision History Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are Approved subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Ver Date Changes By Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies 1.0 16 Jun 2013 Initial J. Kaye materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.