3.0SMC24A Littelfuse

Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Pb e3 RoHS 3.0SMC Series Description Uni-directional The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Maximum Ratings and Thermal Characteristics O (T =25 C unless otherwise noted) A For surface mounted Fast response time: applications in order to typically less than 1.0ps Parameter Symbol Value Unit optimize board space from 0V to BV min Power Dissipation on Infinite Heat Low profile package Excellent clamping P 6.5 W O D Sink at T =50 C L capability Typical failure mode is Peak Forward Surge Current, 8.3ms short from over-specified Low incremental surge I 300 A FSM Single Half Sine Wave (Note 1) voltage or current resistance Maximum Instantaneous Forward Whisk er test is conducted High temperat ure to reflow Voltage at 100A for Unidirectional V 3.5 V F based on JEDEC soldering guaranteed: Only JESD201A per its table 4a 260C/40sec Operating Temperature Range T -65 to 150 C J and 4c Meet MSL level1, per Storage Temperature Range T -65 to 175 C STG IEC-61000-4-2 ESD J-STD-020, LF maximun Typical Thermal Resistance Junction C/W 30kV(Air), 30kV (Contact) peak of 260C R 15 JL to Lead I is specified 8/20S Matte tin leadfree plated PP Typical Thermal Resistance Junction C/W surge waveform R 75 Halogen free and RoHS JA to Ambient Built-in strain relief compliant Notes: V T = V 25C 1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional Pb-free E3 means 2nd BR J BR device only, duty cycle=4 per minute maximum. x (1+ T x (T - 25)) level interconnect is J (T:Temperature Pb-free and the terminal Coefficient, typical value is finish material is tin(Sn) 0.1%) (IPC/JEDEC J-STD- Functional Diagram Glass passivated chip 609A.01) Bi-directional junction Cathode Anode Uni-directional Additional Infomarion Applications TVS devices are ideal for the protection of I/O Interfaces, V bus and other vulnerable circuits used in Telecom, CC Computer, Industrial and Consumer electronic applications. Datasheet Resources Samples 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Electrical Characteristics (T =25C unless otherwise noted) A Breakdown Test Maximum TVS Diode Arrays (SPA Family of Products) Reverse Voltage V Maximum Peak Maximum BR Part Clamping Current Stand off Pulse Current Reverse (Volts) I T Number Marking Voltage V C Voltage V I 8/20S Leakage I V I R pp R R T (Uni) 8/20S (Volts) (A) (A) (mA) MIN MAX I (V) pp 3.0SMC20A YLA 20.0 22.20 24.50 1 42 570 1 3.0SMC24A YLC 24.0 26.70 29.50 1 51 520 1 3.0SMC28A YLE 28.0 31.10 34.40 1 59 470 1 3.0SMC30A YLF 30.0 33.30 36.80 1 62 420 1 3.0SMC33A YLG 33.0 36.70 40.60 1 70 365 1 I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp P Peak Pulse Power Dissipation -- Max power dissipation PPM V Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation R V Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (I ) BR T V Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) C I Reverse Leakage Current -- Current measured at V R R V Forward Voltage Drop for Uni-directional F Ratings and Characteristic Curves (T =25C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating 1000 Voltage Transients T initial = T J amb 100 Voltage Across TVS Current Through TVS 10 1 0.31x0.31 (8.0x8.0mm) Copper Pad Area 0.1 10 0.001 0.01 0.11 t -Pulse Width (ms) d Time continues on next page. 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Voltage or Current P -Peak Pulse Power (KW) PPM