PulseGuard Suppressors Surface Mount Polymeric ESD Suppressors PGB Series 0603 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for low- voltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394 SM and InfiniBand can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883C). Features Ultra-low capacitance Low leakage current Fast response time Single line of protection Bi-directional Reference Dimensions: Withstands multiple ESD strikes 1.60 (.063 ) Standard EIA SOCM-1608 package 0.076 (.003 ) MIN Compatible with pick-and-place processes 1.04 (.041 ) REF Available in 1,000 and 5,000 piece reels (EIA-RS481) 0.787 (.031 ) Typical Applications Servers 0.254 (.010 ) MIN Laptop/Desktop Computers 0.356 (.014 ) Network Hardware Wave Reflow Solder Solder Computer Peripherals 0.508 (.020 ) 0.762 (.030 ) Digital Cameras External Storage 3.30 (1.30 ) 3.05 (1.20 ) 1.27 (.050 ) Ordering Information 1.27 (.050 ) CATALOG NUMBER PIECES PER REEL 0.762 (.030 ) 0.762 (.030 ) PGB0010603MR 1,000 PGB0010603NR 5,000 Equivalent Circuit 2 1 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 208 www.littelfuse.com PulseGuard Suppressors Surface Mount Polymeric ESD Suppressors PGB Series 0603 ESD Suppressor Capacitance vs. Frequency Electrical Characteristics ESD Capability: ** Note: 1,000 fF = 1 pF IEC 61000-4-2 Direct Discharge ....................................................8kV 70 IEC 61000-4-2 Air Discharge .......................................................15kV 1 Trigger Voltage ...................................................................1,000V, typical 60 1 Clamping Voltage ..................................................................150V, typical Rated Voltage ........................................................................24VDC, max 2 Capacitance ................................................................................0.055 pF 50 1 Response Time ...............................................................................< 1 ns 3 Leakage Current ..............................................................................< 1nA 4 40 4 ESD Pulse Withstand ...........................................1,000 pulses, minimum 0.5 1.0 1.5 2.0 Notes: Frequency (GHz) 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested Carrier Tape Specifications over multiple pulses at a very rapid rate. Parts are delivered on 7 (178mm) reel, paper carrier tape Environmental Specifications T D t s Operating Temperature: -65C to +125C. D d Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85C, 1000hrs. +++ + Thermal Shock: MIL-STD-202, Method 107G, -65C to 125C, 30 min cycle, 10 cycles. T w Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, + + P + + P d h 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs 40C, 3 solutions (H2O, P detergent solution, defluxer) w P s Solder leach resistance and terminal adhesion: Per EIA-576 test C t Physical Specifications Materials: Body: Glass Epoxy Terminations: Copper/Nickel/Tin/Lead Solderability: DESCRIPTION MEASUREMENT (MM) MIL-STD-202, Method 208 (95% coverage) C - Cover tape thickness 0.06 t Soldering Parameters: Wave Solder 260C, 10 seconds maximum. D - Drive hole diameter 1.50 d Reflow Solder 260C, 30 seconds maximum. D - Drive hole spacing 4.00 s Packaging Specifications P - Pocket depth 0.58 d 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3) 1,000 pieces per P - Pocket height 1.85 h reel, add packaging suffix, MR 5,000 per reel, add packaging suffix NR. Ps - Pocket spacing 4.00 P - Pocket width 1.02 w T - Carrier tape thickness 0.65 t T - Carrier tape width 8.00 w 209 www.littelfuse.com Capacitance (fF) PULSEGUARD SUPPRESSORS