TVS Diode Arrays (SPA Diodes) Low Capacitance ESD Protection - SP3030 Series RoHS Pb GREEN SP3030 Series 0.5pF 20kV Unidirectional Discrete TVS Description The SP3030 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI, USB2.0, USB3.0 and eSATA. Features Pinout ESD protection of 20kV Low capacitance of 0.5pF contact discharge, V =0V R 30kV air discharge, L ow leakage current of 1 (IEC61000-4-2) 0.1A at 5V EFT protection, Small SOD882 pac kaging IEC61000-4-4, 40A helps save board space (t =5/50ns) p AEC-Q101 qualified Lightning Protection, (SOD882 package) 2 IEC61000-4-5, 3A (t =8/20s) p (AEC-Q101 qualied) Applications Functional Block Diagram Tablets Digital Cameras 1 Ultrabook MP3/ PMP eReader Set Top Boxes Smart Phones Portable Medical USB3.0 Application Example 2 USB Port USB Controller Life Support Note: Not Intended for Use in Life Support or Life Saving Applications V BU S The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP1003 *Packages are shown as transparent HDMI Application Example D+ IC D- HDMI HDMI Port Chipset *Packages are shown as transparent SSTX+ D2+ SSTX- D2- SSRX+ D1+ D1- SSRX- D0+ D0- CLK+ CLK- Signal Ground IC SP3030 (x6) SP3030 (x8) CEC Additional Information SCL SDA HPD PWR SP3002 Datasheet Resources Samples 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA Diodes) Low Capacitance ESD Protection - SP3030 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t =8/20s) 3.0 A PP p Storage Temperature Range -55 to 150 C Maximum Junction Temperature 150 C T Operating Temperature -40 to 125 C OP Maximum Lead Temperature 260 C T Storage Temperature -55 to 150 C STOR (Soldering 20-40s) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25C) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V 5 V RWM Reverse Leakage Current I V =5V with 1pin at GND 0.1 0.5 A LEAK R I =1A, t =8/20s, Fwd 9.2 V PP p 1 Clamp Voltage V C I =2A, t =8/20s, Fwd 10.0 V PP p IEC61000-4-2 (Contact) 20 kV 1 ESD Withstand Voltage V ESD IEC61000-4-2 (Air) 30 kV Dynamic Resistance R (V -V )/(I -I ) 0.55 DYN C2 C1 PP2 PP1 1 Diode Capacitance C Reverse Bias=0V, f=1 MHz 0.5 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Normalized Capacitance vs. Reverse Voltage 0 2.0 1.8 -1 -2 1.6 -3 1.4 1.2 -4 1.0 -5 0.8 -6 0.6 -7 0.4 -8 0.2 -9 -10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 1001000 Bias Voltage (V) Frequency (MHz) HDMI 1.4 Eye Diagram USB3.0 Eye Diagram 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 Attenuation (dB) Normalized Capacitance (pF) SP3030