X-On Electronics has gained recognition as a prominent supplier of MX25L12835FMI-10G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L12835FMI-10G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L12835FMI-10G Macronix

MX25L12835FMI-10G electronic component of Macronix
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See Product Specifications
Part No.MX25L12835FMI-10G
Manufacturer: Macronix
Category: NOR Flash
Description: FLASH FLASH 128Mb (16M x 8) SPI SOIC-16 RoHS
Datasheet: MX25L12835FMI-10G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
14: USD 2.379 ea
Line Total: USD 33.31 
Availability - 0
MOQ: 14  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 14
Multiples : 1
14 : USD 2.379
25 : USD 2.353
50 : USD 2.327
150 : USD 2.288
300 : USD 2.236

0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 44
Multiples : 44
44 : USD 2.2802

0
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ : 1
Multiples : 1
1 : USD 5.3066
10 : USD 4.6064
30 : USD 4.1884
100 : USD 3.7668
500 : USD 3.5721
1000 : USD 3.4843

0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 3
Multiples : 1
3 : USD 3.5215
10 : USD 3.2437
25 : USD 3.172
50 : USD 2.9971
100 : USD 2.8825
250 : USD 2.7162

   
Manufacturer
Product Category
Package / Case
Memory Size
Interface Type
Brand
Rohs
Memory Type
Memory Format
Voltage - Supply
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MX25L12835FMI-10G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L12835FMI-10G and other electronic components in the NOR Flash category and beyond.

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MX25L12835F MX25L12835F 3V, 128M-BIT x 1/x 2/x 4 CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY P/N: PM1795MX25L12835F Contents 1. FEATURES ..............................................................................................................................................................4 2. GENERAL DESCRIPTION .....................................................................................................................................6 Table 1. Read performance Comparison ....................................................................................................6 3. PIN CONFIGURATIONS .........................................................................................................................................7 4. PIN DESCRIPTION ..................................................................................................................................................7 5. BLOCK DIAGRAM ...................................................................................................................................................8 6. DATA PROTECTION ................................................................................................................................................9 Table 2. Protected Area Sizes ...................................................................................................................10 Table 3. 4K-bit Secured OTP Definition .................................................................................................... 11 7. Memory Organization ...........................................................................................................................................12 Table 4. Memory Organization ..................................................................................................................12 8. DEVICE OPERATION ............................................................................................................................................13 8-1. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 15 9. COMMAND DESCRIPTION ...................................................................................................................................16 Table 5. Command Set ..............................................................................................................................16 9-1. Write Enable (WREN) .............................................................................................................................. 20 9-2. Write Disable (WRDI) ............................................................................................................................... 21 9-3. Read Identification (RDID) ....................................................................................................................... 22 9-4. Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 23 9-5. Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 25 9-6. QPI ID Read (QPIID) ............................................................................................................................... 26 Table 6. ID Definitions ..............................................................................................................................26 9-7. Read Status Register (RDSR) ................................................................................................................. 27 9-8. Read Configuration Register (RDCR) ...................................................................................................... 28 Table 7. Configuration Register Table .......................................................................................................32 9-9. Write Status Register (WRSR) ................................................................................................................. 34 Table 8. Protection Modes .........................................................................................................................35 9-10. Read Data Bytes (READ) ........................................................................................................................ 38 9-11. Read Data Bytes at Higher Speed (FAST READ) .................................................................................. 39 9-12. Dual Output Read Mode (DREAD) .......................................................................................................... 40 9-13. 2 x I/O Read Mode (2READ) ................................................................................................................... 41 9-14. Quad Read Mode (QREAD) .................................................................................................................... 42 9-15. 4 x I/O Read Mode (4READ) ................................................................................................................... 43 9-16. Burst Read ............................................................................................................................................... 45 9-17. Performance Enhance Mode ................................................................................................................... 46 9-18. Fast Boot ................................................................................................................................................. 49 9-19. Sector Erase (SE) .................................................................................................................................... 52 9-20. Block Erase (BE32K) ............................................................................................................................... 53 9-21. Block Erase (BE) ..................................................................................................................................... 54 9-22. Chip Erase (CE) ....................................................................................................................................... 55 9-23. Page Program (PP) ................................................................................................................................. 56 9-24. 4 x I/O Page Program (4PP) .................................................................................................................... 58 9-25. Deep Power-down (DP) ........................................................................................................................... 59 P/N: PM1795 Rev. 1.6, July 22, 2016 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Macronix International
MX7
MXA
MXIC(Macronix)
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