X-On Electronics has gained recognition as a prominent supplier of MX25L3233FM2I-08G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L3233FM2I-08G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L3233FM2I-08G Macronix

MX25L3233FM2I-08G electronic component of Macronix
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See Product Specifications
Part No.MX25L3233FM2I-08G
Manufacturer: Macronix
Category: NOR Flash
Description: flash flash 32mb serial sop-8 (200mil) rohs
Datasheet: MX25L3233FM2I-08G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
62: USD 0.52 ea
Line Total: USD 32.24 
Availability - 9435
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ: 62  Multiples: 1
Pack Size: 1
Availability Price Quantity
9435
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 62
Multiples : 1
62 : USD 0.52
75 : USD 0.52
200 : USD 0.52
400 : USD 0.52
1250 : USD 0.52

19400
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 2000
Multiples : 2000
2000 : USD 0.546

   
Manufacturer
Product Category
Package / Case
Memory Size
Maximum Clock Frequency
Interface Type
Rohs
Brand Category
Memory Type
Memory Format
Technology
Byte-Program Time - Tbp
Page Programming Time - Tpp
Voltage - Supply
Operating Temperature
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MX25L3233FM2I-08G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L3233FM2I-08G and other electronic components in the NOR Flash category and beyond.

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MX25L3233F MX25L3233F 3V, 32M-BIT x 1/x 2/x 4 CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY Key Features Hold Feature Multi I/O Support - Single I/O, Dual I/O and Quad I/O Auto Erase and Auto Program Algorithms Program Suspend/Resume & Erase Suspend/Resume P/N: PM2113 Rev. 1.6, March 10, 2017 1MX25L3233F Contents 1. FEATURES ........................................................................................................................................................ 5 2. GENERAL DESCRIPTION ............................................................................................................................... 6 3. PIN CONFIGURATION ...................................................................................................................................... 7 4. PIN DESCRIPTION ............................................................................................................................................ 7 5. BLOCK DIAGRAM ............................................................................................................................................. 8 6. DATA PROTECTION .......................................................................................................................................... 9 Table 1. Protected Area Sizes ..............................................................................................................10 Table 2. 4K-bit Secured OTP Definition ............................................................................................... 11 7. MEMORY ORGANIZATION ............................................................................................................................. 12 Table 3. Memory Organization .............................................................................................................12 8. DEVICE OPERATION ...................................................................................................................................... 13 9. HOLD FEATURE .............................................................................................................................................. 14 10. COMMAND DESCRIPTION ........................................................................................................................... 16 Table 4. Command Sets .......................................................................................................................16 10-1. Write Enable (WREN) ..........................................................................................................................19 10-2. Write Disable (WRDI) ...........................................................................................................................20 10-3. Read Identification (RDID) ...................................................................................................................21 10-4. Read Status Register (RDSR) .............................................................................................................22 10-5. Read Configuration Register (RDCR) ..................................................................................................23 Table 5. Status Register .......................................................................................................................24 Table 6. Configuration Register ............................................................................................................25 Table 7. Dummy Cycle and Frequency Table .......................................................................................25 10-6. Write Status Register (WRSR) .............................................................................................................26 Table 8. Protection Modes ....................................................................................................................27 10-7. Read Data Bytes (READ) ....................................................................................................................29 10-8. Read Data Bytes at Higher Speed (FAST READ) ..............................................................................30 10-9. Dual Read Mode (DREAD) ..................................................................................................................31 10-10. 2 x I/O Read Mode (2READ) ...............................................................................................................32 10-11. Quad Read Mode (QREAD) ................................................................................................................33 10-12. 4 x I/O Read Mode (4READ) ...............................................................................................................34 10-13. Performance Enhance Mode ...............................................................................................................36 10-14. Burst Read ...........................................................................................................................................37 10-15. Sector Erase (SE) ................................................................................................................................38 10-16. Block Erase (BE) .................................................................................................................................39 10-17. Block Erase (BE32K) ...........................................................................................................................40 10-18. Chip Erase (CE) ...................................................................................................................................41 10-19. Page Program (PP) .............................................................................................................................42 10-20. 4 x I/O Page Program (4PP) ................................................................................................................43 10-21. Deep Power-down (DP) .......................................................................................................................46 10-22. Release from Deep Power-down (RDP), Read Electronic Signature (RES) .......................................47 10-23. Read Electronic Manufacturer ID & Device ID (REMS) .......................................................................49 Table 9. ID Definitions .........................................................................................................................50 10-24. Enter Secured OTP (ENSO) ................................................................................................................50 10-25. Exit Secured OTP (EXSO) ...................................................................................................................50 10-26. Read Security Register (RDSCUR) .....................................................................................................51 Table 10. Security Register Definition ..................................................................................................52 10-27. Write Security Register (WRSCUR) .....................................................................................................53 P/N: PM2113 Rev. 1.6, March 10, 2017 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Macronix International
MX7
MXA
MXIC(Macronix)
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