X-On Electronics has gained recognition as a prominent supplier of MX25L6406EM2I-12G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L6406EM2I-12G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L6406EM2I-12G Macronix

MX25L6406EM2I-12G electronic component of Macronix
MX25L6406EM2I-12G Macronix
MX25L6406EM2I-12G NOR Flash
MX25L6406EM2I-12G Semiconductors

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See Product Specifications
Part No. MX25L6406EM2I-12G
Manufacturer: Macronix
Category: NOR Flash
Description: FLASH FLASH 64Mb (64M x 1, 32M x 2) SPI SOIC-8_208mil RoHS
Datasheet: MX25L6406EM2I-12G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.8592 ea
Line Total: USD 1.86 
Availability - 209
Ship by Fri. 10 Jan to Wed. 15 Jan
MOQ: 1  Multiples: 1
Pack Size: 1

 MX25L6406EM2I-12G More Buying Options & Price Grid(s)

Availability Price Quantity
209
Ship by Fri. 10 Jan to Wed. 15 Jan
MOQ : 1
Multiples : 1
1 : USD 1.8592
10 : USD 1.6162
30 : USD 1.4844
100 : USD 1.3338
500 : USD 1.1455
1000 : USD 1.1154

Specifications

   
Manufacturer
Product Category
Package / Case
Memory Size
Interface Type
Brand
Rohs
Memory Type
Memory Format
Voltage - Supply
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MX25L6406EM2I-12G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6406EM2I-12G and other electronic components in the NOR Flash category and beyond.

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Additional Infomation About Product

MX25L6406E MX25L6406E DATASHEET P/N: PM1577 REV. 1.1, NOV. 17, 2010 1MX25L6406E Contents FEATURES ..................................................................................................................................................................5 GENERAL DESCRIPTION .........................................................................................................................................6 PIN CONFIGURATIONS .............................................................................................................................................7 PIN DESCRIPTION ......................................................................................................................................................7 BLOCK DIAGRAM .......................................................................................................................................................8 MEMORY ORGANIZATION .........................................................................................................................................9 Table 1. Memory Organization ............................................................................................................................ 9 DEVICE OPERATION ................................................................................................................................................10 Figure 1. Serial Modes Supported ....................................................................................................... 10 DATA PROTECTION .................................................................................................................................................. 11 Table 2. Protected Area Sizes ............................................................................................................................ 12 Table 3. 512 bit Secured OTP Definition ........................................................................................................... 12 HOLD FEATURES .....................................................................................................................................................13 Figure 2. Hold Condition Operation ........................................................................................................ 13 COMMAND DESCRIPTION .......................................................................................................................................14 Table 4. COMMAND DEFINITION ..................................................................................................................... 14 (1) Write Enable (WREN) ................................................................................................................................... 15 (2) Write Disable (WRDI) .................................................................................................................................... 15 (3) Read Status Register (RDSR) ...................................................................................................................... 15 (4) Write Status Register (WRSR) ...................................................................................................................... 16 Table 5. Protection Modes .................................................................................................................................. 17 (5) Read Data Bytes (READ) ............................................................................................................................. 18 (6) Read Data Bytes at Higher Speed (FAST READ) ....................................................................................... 18 (7) Dual Output Mode (DREAD) ......................................................................................................................... 18 (8) Sector Erase (SE) ......................................................................................................................................... 18 (9) Block Erase (BE) ........................................................................................................................................... 19 (10) Chip Erase (CE) .......................................................................................................................................... 19 (11) Page Program (PP) ..................................................................................................................................... 19 (12) Deep Power-down (DP) .............................................................................................................................. 20 (13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 20 (14) Read Identification (RDID) .......................................................................................................................... 21 (15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 21 Table 6. ID DEFINITIONS ................................................................................................................................. 22 (16) Enter Secured OTP (ENSO) ....................................................................................................................... 22 (17) Exit Secured OTP (EXSO) .......................................................................................................................... 22 (18) Read Security Register (RDSCUR) ............................................................................................................ 23 Table 7. SECURITY REGISTER DEFINITION ................................................................................................... 23 (19) Write Security Register (WRSCUR) ............................................................................................................ 23 P/N: PM1577 REV. 1.1, NOV. 17, 2010 2

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

MACRONIX may also be referenced as

Macronix International
MX7
MXA
MXIC(Macronix)

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