X-On Electronics has gained recognition as a prominent supplier of MX25L6406EM2I-12G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L6406EM2I-12G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L6406EM2I-12G Macronix

Name: MX25L6406EM2I-12G
Brand: Macronix
SKU: MX25L6406EM2I12G_Macronix
Availability: OutOfStock
Rating: 5 (11 reviews)

MX25L6406EM2I-12G electronic component of Macronix

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See Product Specifications

Part No.	MX25L6406EM2I-12G
Manufacturer:	Macronix
Category:	NOR Flash
Description:	FLASH FLASH 64Mb (64M x 1, 32M x 2) SPI SOIC-8_208mil RoHS
Datasheet:	MX25L6406EM2I-12G Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

25: USD 1.3 ea
Line Total: USD 32.5

Availability - 0

MOQ: 25 Multiples: 1
Pack Size: 1

MX25L6406EM2I-12G More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
526 Ship by Fri. 06 Dec to Wed. 11 Dec MOQ : 1 Multiples : 1	1 : USD 1.8942 10 : USD 1.6515 30 : USD 1.5198 100 : USD 1.3693 500 : USD 1.1812 1000 : USD 1.1511

Specifications

Manufacturer Macronix Macronix
Product Category NOR Flash NOR Flash
Package / Case SOIC - 8 208MIL SOIC - 8 208MIL
Memory Size 64 mb (64M x 1 , 32M x 2) 64 mb (64M x 1 , 32M x 2)
Interface Type SPI SPI
Brand Macronix Macronix
Rohs Y Y
Memory Type Non - Volatile Non - Volatile
Memory Format FLASH FLASH
Voltage - Supply 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V

We are delighted to provide the MX25L6406EM2I-12G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6406EM2I-12G and other electronic components in the NOR Flash category and beyond.

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Additional Infomation About Product

MX25L6406E MX25L6406E DATASHEET P/N: PM1577 REV. 1.1, NOV. 17, 2010 1MX25L6406E Contents FEATURES ..................................................................................................................................................................5 GENERAL DESCRIPTION .........................................................................................................................................6 PIN CONFIGURATIONS .............................................................................................................................................7 PIN DESCRIPTION ......................................................................................................................................................7 BLOCK DIAGRAM .......................................................................................................................................................8 MEMORY ORGANIZATION .........................................................................................................................................9 Table 1. Memory Organization ............................................................................................................................ 9 DEVICE OPERATION ................................................................................................................................................10 Figure 1. Serial Modes Supported ....................................................................................................... 10 DATA PROTECTION .................................................................................................................................................. 11 Table 2. Protected Area Sizes ............................................................................................................................ 12 Table 3. 512 bit Secured OTP Definition ........................................................................................................... 12 HOLD FEATURES .....................................................................................................................................................13 Figure 2. Hold Condition Operation ........................................................................................................ 13 COMMAND DESCRIPTION .......................................................................................................................................14 Table 4. COMMAND DEFINITION ..................................................................................................................... 14 (1) Write Enable (WREN) ................................................................................................................................... 15 (2) Write Disable (WRDI) .................................................................................................................................... 15 (3) Read Status Register (RDSR) ...................................................................................................................... 15 (4) Write Status Register (WRSR) ...................................................................................................................... 16 Table 5. Protection Modes .................................................................................................................................. 17 (5) Read Data Bytes (READ) ............................................................................................................................. 18 (6) Read Data Bytes at Higher Speed (FAST READ) ....................................................................................... 18 (7) Dual Output Mode (DREAD) ......................................................................................................................... 18 (8) Sector Erase (SE) ......................................................................................................................................... 18 (9) Block Erase (BE) ........................................................................................................................................... 19 (10) Chip Erase (CE) .......................................................................................................................................... 19 (11) Page Program (PP) ..................................................................................................................................... 19 (12) Deep Power-down (DP) .............................................................................................................................. 20 (13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 20 (14) Read Identification (RDID) .......................................................................................................................... 21 (15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 21 Table 6. ID DEFINITIONS ................................................................................................................................. 22 (16) Enter Secured OTP (ENSO) ....................................................................................................................... 22 (17) Exit Secured OTP (EXSO) .......................................................................................................................... 22 (18) Read Security Register (RDSCUR) ............................................................................................................ 23 Table 7. SECURITY REGISTER DEFINITION ................................................................................................... 23 (19) Write Security Register (WRSCUR) ............................................................................................................ 23 P/N: PM1577 REV. 1.1, NOV. 17, 2010 2

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

MACRONIX may also be referenced as

Macronix International
MX7
MXA
MXIC(Macronix)

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