X-On Electronics has gained recognition as a prominent supplier of MX25L6445EM2I-10G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L6445EM2I-10G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L6445EM2I-10G Macronix

Name: MX25L6445EM2I-10G
Brand: Macronix
SKU: MX25L6445EM2I10G_Macronix
Availability: OutOfStock
Rating: 5 (11 reviews)

MX25L6445EM2I-10G electronic component of Macronix

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See Product Specifications

Part No.	MX25L6445EM2I-10G
Manufacturer:	Macronix
Category:	NOR Flash
Description:	FLASH FLASH 64Mb (64M x 1, 32M x 2, 16M x 4) SPI SOIC-8_208mil RoHS
Datasheet:	MX25L6445EM2I-10G Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 1.9806 ea
Line Total: USD 1.98

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

MX25L6445EM2I-10G More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
252 Ship by Thu. 14 Nov to Wed. 20 Nov MOQ : 18 Multiples : 1	18 : USD 1.794 25 : USD 1.794 75 : USD 1.794 150 : USD 1.794 400 : USD 1.794

Specifications

Manufacturer Macronix Macronix
Product Category NOR Flash NOR Flash
Package / Case SOIC - 8 208MIL SOIC - 8 208MIL
Memory Size 64 mb (64M x 1 , 32M x 2 , 16M x 4) 64 mb (64M x 1 , 32M x 2 , 16M x 4)
Interface Type SPI SPI
Brand Macronix Macronix
Rohs Y Y
Memory Type Non - Volatile Non - Volatile
Memory Format FLASH FLASH
Voltage - Supply 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V

We are delighted to provide the MX25L6445EM2I-10G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6445EM2I-10G and other electronic components in the NOR Flash category and beyond.

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Additional Infomation About Product

MX25L6445E MX25L6445E HIGH PERFORMANCE SERIAL FLASH SPECIFICATION P/N: PM1736 REV. 1.8, DEC. 26, 2011 1MX25L6445E Contents FEATURES ..................................................................................................................................................................5 GENERAL DESCRIPTION .........................................................................................................................................7 Table 1. Additional Features .............................................................................................................................. 7 PIN CONFIGURATION ................................................................................................................................................8 PIN DESCRIPTION ......................................................................................................................................................8 BLOCK DIAGRAM .......................................................................................................................................................9 DATA PROTECTION ..................................................................................................................................................10 Table 2. Protected Area Sizes .......................................................................................................................... 11 Table 3. 4K-bit Secured OTP Definition ............................................................................................................ 11 Memory Organization ...............................................................................................................................................12 Table 4. Memory Organization ......................................................................................................................... 12 DEVICE OPERATION ................................................................................................................................................13 Figure 1-1. Serial Modes Supported (for Normal Serial mode) ........................................................................ 13 Figure 1-2. Serial Modes Supported (for Double Transfer Rate serial read mode) .......................................... 13 COMMAND DESCRIPTION .......................................................................................................................................14 Table 5. Command Sets ................................................................................................................................... 14 (1) Write Enable (WREN) ................................................................................................................................. 16 (2) Write Disable (WRDI) .................................................................................................................................. 16 (3) Read Identification (RDID) .......................................................................................................................... 16 (4) Read Status Register (RDSR) .................................................................................................................... 17 (5) Write Status Register (WRSR) .................................................................................................................... 18 Protection Modes ............................................................................................................................................. 18 (6) Read Data Bytes (READ) ........................................................................................................................... 19 (7) Read Data Bytes at Higher Speed (FAST READ) ..................................................................................... 19 (8) Fast Double Transfer Rate Read (FASTDTRD) .......................................................................................... 19 (9) 2 x I/O Read Mode (2READ) ...................................................................................................................... 19 (10) 2 x I/O Double Transfer Rate Read Mode (2DTRD) ................................................................................. 20 (11) 4 x I/O Read Mode (4READ) ..................................................................................................................... 20 (12) 4 x I/O Double Transfer Rate Read Mode (4DTRD) ................................................................................. 21 (13) Sector Erase (SE) ..................................................................................................................................... 21 (14) Block Erase (BE)....................................................................................................................................... 22 (15) Block Erase (BE32K) ................................................................................................................................ 22 (16) Chip Erase (CE) ........................................................................................................................................ 22 (17) Page Program (PP)................................................................................................................................... 23 (18) 4 x I/O Page Program (4PP) ..................................................................................................................... 23 Program/Erase Flow(1) with read array data ................................................................................................... 24 Program/Erase Flow(2) without read array data .............................................................................................. 25 (19) Continuously program mode (CP mode) .................................................................................................. 26 (20) Deep Power-down (DP) ............................................................................................................................ 27 (21) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................ 27 (22) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4), (REMS4D) ....................... 27 Table 6. ID Definitions ..................................................................................................................................... 28 (23) Enter Secured OTP (ENSO) ..................................................................................................................... 28 (24) Exit Secured OTP (EXSO) ........................................................................................................................ 28 P/N: PM1736 REV. 1.8, DEC. 26, 2011 2

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

MACRONIX may also be referenced as

Macronix International
MX7
MXA
MXIC(Macronix)

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