X-On Electronics has gained recognition as a prominent supplier of MX25L6473EM2I-10G NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25L6473EM2I-10G NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25L6473EM2I-10G Macronix

MX25L6473EM2I-10G electronic component of Macronix
Images are for reference only
See Product Specifications
Part No.MX25L6473EM2I-10G
Manufacturer: Macronix
Category: NOR Flash
Description: NOR Flash Serial-SPI 3.3V 64M-bit 64M/32M/16M x 1/2-bit/4-bit 8ns
Datasheet: MX25L6473EM2I-10G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
300: USD 1.5545 ea
Line Total: USD 466.35 
Availability - 873
Ship by Thu. 14 Nov to Wed. 20 Nov
MOQ: 300  Multiples: 300
Pack Size: 300
Availability Price Quantity
873
Ship by Thu. 14 Nov to Wed. 20 Nov
MOQ : 300
Multiples : 300
300 : USD 1.5545

   
Manufacturer
Product Category
Interface Type
Timing Type
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Address Bus
Programmable
Program/Erase Volt Typ
Operating Temp Range
Rad Hardened
Access Time Max
Operating Temperature Classification
Density
Operating Supply Voltage Typ
Boot Type
Cell Type
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We are delighted to provide the MX25L6473EM2I-10G from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25L6473EM2I-10G and other electronic components in the NOR Flash category and beyond.

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MX25L6473E MX25L6473E 3V, 64M-BIT x 1/x 2/x 4 CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY Key Features Multi I/O Support - Single I/O, Dual I/O and Quad I/O Auto Erase and Auto Program Algorithms Continuous Program mode Permanently fixed QE bit, QE=1 and 4 I/O mode is enabled P/N: PM1907 REV. 1.4, JUN. 16, 2015 1MX25L6473E Contents 1. FEATURES ........................................................................................................................................................ 4 2. GENERAL DESCRIPTION ............................................................................................................................... 6 Table 1. Read Performance ..................................................................................................................6 3. PIN CONFIGURATION ...................................................................................................................................... 7 4. PIN DESCRIPTION ............................................................................................................................................ 7 5. BLOCK DIAGRAM ............................................................................................................................................. 8 6. DATA PROTECTION .......................................................................................................................................... 9 Table 2. Protected Area Sizes ..............................................................................................................10 Table 3. 4K-bit Secured OTP Definition ............................................................................................... 11 7. MEMORY ORGANIZATION ............................................................................................................................. 12 Table 4. Memory Organization .............................................................................................................12 8. DEVICE OPERATION ...................................................................................................................................... 13 9. COMMAND DESCRIPTION ............................................................................................................................. 14 Table 5. Command Sets .......................................................................................................................14 9-1. Write Enable (WREN) ..........................................................................................................................17 9-2. Write Disable (WRDI) ...........................................................................................................................18 9-3. Read Identification (RDID) ...................................................................................................................19 9-4. Read Status Register (RDSR) .............................................................................................................20 9-5. Write Status Register (WRSR) .............................................................................................................23 Table 6. Protection Modes ....................................................................................................................24 9-6. Read Data Bytes (READ) ....................................................................................................................26 9-7. Read Data Bytes at Higher Speed (FAST READ) ..............................................................................27 9-8. Dual Read Mode (DREAD) ..................................................................................................................28 9-9. 2 x I/O Read Mode (2READ) ...............................................................................................................29 9-10. Quad Read Mode (QREAD) ................................................................................................................30 9-11. 4 x I/O Read Mode (4READ) ...............................................................................................................31 9-12. Performance Enhance Mode ...............................................................................................................32 9-13. Performance Enhance Mode Reset (FFh) ...........................................................................................32 9-14. Sector Erase (SE) ................................................................................................................................35 9-15. Block Erase (BE) .................................................................................................................................36 9-16. Block Erase (BE32K) ...........................................................................................................................37 9-17. Chip Erase (CE) ...................................................................................................................................38 9-18. Page Program (PP) .............................................................................................................................39 9-19. 4 x I/O Page Program (4PP) ................................................................................................................40 9-20. Continuous Program mode (CP mode) ................................................................................................43 9-21. Deep Power-down (DP) .......................................................................................................................45 9-22. Release from Deep Power-down (RDP), Read Electronic Signature (RES) .......................................46 9-23. Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) .....................................48 9-24. ID Read ................................................................................................................................................49 Table 7. ID Definitions .........................................................................................................................49 9-25. Enter Secured OTP (ENSO) ................................................................................................................49 9-26. Exit Secured OTP (EXSO) ...................................................................................................................49 9-27. Read Security Register (RDSCUR) .....................................................................................................50 Table 8. Security Register Definition ....................................................................................................51 9-28. Write Security Register (WRSCUR) .....................................................................................................52 P/N: PM1907 REV. 1.4, JUN. 16, 2015 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Macronix International
MX7
MXA
MXIC(Macronix)
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