Model : MBA27002 Series MBA27002 Series BGA Heat Sink For 27x27 Chip set Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic (UL94-V0) 2.Heat sink dimension : Foot print : 27x27mm Part no. Height Fin shape Base Clip Weight MBA27002- 12 P/2.6 - Y, BU, O 27.9g MBA27002- 15 P/2.6 - Y, BU, O 30.9g MBA27002- 20 P/2.6 - Y, BU, O 35.9g 5. Clip available: MBA27002- 25 P/2.6 - Y, BU, O 40.9g Chip set thickness 3.0-3.6mm Y -Yellow colored clip 3.Technology: Precision Forging 1.4-2.0mm BU - Blue colored clip 4.Finish: Oxygenless Treament 0.5-1.1mm O - Orange colored clip Performance Data: 7.2 0.24 6.6 0.22 Thermal resistance MBA27002-12PCU/2.6 6.0 0.20 Thermal resistance MBA27002-15PCU/2.6 5.4 0.18 Thermal resistance MBA27002-20PCU/2.6 4.8 0.16 4.2 0.14 Thermal resistance MBA27002-25PCU/2.6 3.6 0.12 Pressure drop MBA27002-12PCU/2.6 3.0 0.10 2.4 0.08 Pressure drop MBA27002-15PCU/2.6 1.8 0.06 Pressure drop MBA27002-20PCU/2.6 1.2 0.04 Pressure drop MBA27002-25PCU/2.6 0.6 0.02 0.0 0.00 0 100 200 300 400 500 600 700 800 900 1000 Air Velocity (LFM) Heat Source Size : Uniform No.5, Min Lung Road, Yang Mei Taiwan, R.O.C. Tel : 886-3-4728155 Fax : 886-3-4725979 E-mail : sales malico.com.tw Rsa (oC/W) Pressure drop (in-H2O)X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for malico manufacturer: Other Similar products are found below : MBH30001-13L/2.0 CMBA024949 MBH375002-12P/2.6 CEBF0145451601-00 CL-Y-35X35 MBH42.5002-12P/2.6