MLX75123RLA-BAG-000-SP Melexis

MLX75123BA Time-of-Flight Companion Chip Preliminary Datasheet All specifications subject to change without notice Features & Benefits Description Combines four high speed ADCs with a MLX75123BA is a fully integrated companion chip digital sensor control for Melexis TOF for Melexis Time-of-Flight (TOF) sensors. Its camera sensors designed for automotive and non-automotive Integrated light source control with applications, including, but not limited to, gesture modulation frequencies between recognition, in-cabin monitoring, skeleton tracking, 12-40 MHz people or obstacle detection and traffic Built-in non-volatile memory to store monitoring. customised operating start-up conditions The sensor interface is designed to connect Programmable modulation frequencies to natively with Melexis TOF sensors like MLX75023 avoid module to module crosstalk and MLX75024. The chip features a configurable Up to 8 raw phases per frame sequencer to control the TOF sensor and converts Pre-processed difference and sum output the analog sensor data via four built-in high-speed modes to reduce the data bandwidth ADCs into 12-bit per pixel image data. The image Continuous or triggered operation modes data is provided through a single ended parallel 2 2 Configurable over I C up to 400kHz camera interface. An I C interface is used to 12-bit parallel camera interface up to program the built-in non-volatile memory and to 80Mpix/s operate the system by controlling register settings. Region of interest (ROI) selection and Furthermore, as required for operation based on binning mode the lock-in principle, the MLX75123BA provides Horizontal and vertical flip/mirror modes the synchronized control signal to drive the Per-phase statistics & diagnostics modulated light source (LED or laser based). 4 general purpose outputs Combined with a Melexis TOF sensor like Ambient operating temperature ranges MLX75023 or MLX75024, the MLX75123BA offers a of -20 +85C and -40 +105C cost-effective, integrated Time-Of-Flight camera AEC-Q100 qualification available solution, supporting an image resolutions of up to 320x240 pixels (QVGA). This chipset can deliver raw TOF data up to 600 frames per second. The device is available in a compact 7x7mm AQFN package and offers a variety of integration possibilities. Figure 1 : MLX75123BA package MLX75123BA Time-of-Flight Companion Chip Preliminary Datasheet Contents Features & Benefits ................................................................................................................................... 1 Description ................................................................................................................................................ 1 1. Datasheet Changelog ............................................................................................................................. 4 2. Ordering Information ............................................................................................................................ 4 3. Application System Architecture............................................................................................................ 5 4. System Block Diagram ........................................................................................................................... 6 5. Pinout Description ................................................................................................................................. 7 1 6. Absolute Maximum Ratings .................................................................................................................. 9 7. Electrical Specifications ......................................................................................................................... 9 7.1. Crystal Oscillator Requirements ......................................................................................................... 9 7.2. Current Consumption ....................................................................................................................... 10 7.3. ADC Characteristics ........................................................................................................................... 12 8. Power Consumption ............................................................................................................................ 13 8.1. Power Up & Down Sequence ........................................................................................................... 13 8.2. Power on reset .................................................................................................................................. 14 9. Output Modes ..................................................................................................................................... 14 9.1. Mode 0: 11bit A-B + error bit .......................................................................................................... 14 9.2. Mode 1: 12bit A-B ............................................................................................................................ 15 9.3. Mode 2: 11bit A+B + error bit ......................................................................................................... 15 9.4. Mode 3: 12bit A+B ........................................................................................................................... 15 9.5. Mode 4: Raw A ................................................................................................................................. 15 9.6. Mode 5: Raw B ................................................................................................................................. 15 10. Parallel Output Sequence & Timing ................................................................................................... 16 11. Distance Calculation .......................................................................................................................... 17 12. I2C Commands .................................................................................................................................. 18 2 12.1. I C READ ......................................................................................................................................... 18 2 12.2. I C WRITE ....................................................................................................................................... 18 2 12.3. I C RESET ........................................................................................................................................ 19 2 12.4. I C GLOBAL RESET ......................................................................................................................... 19 2 12.5. I C SAVEREGMAP ........................................................................................................................... 19 13. Registers ............................................................................................................................................ 20 13.1. Configuration Parameter Registers ............................................................................................... 21 13.2. FrameTable & Phase Registers ....................................................................................................... 24 Page 2 of 47 Revision 0.4 NOV 13, 2018 All specifications subject to change without notice