X-On Electronics has gained recognition as a prominent supplier of MLX75123RLA-BAG-000-SP sensor interface across the USA, India, Europe, Australia, and various other global locations. MLX75123RLA-BAG-000-SP sensor interface are a product manufactured by Melexis. We provide cost-effective solutions for sensor interface, ensuring timely deliveries around the world.

MLX75123RLA-BAG-000-SP Melexis

MLX75123RLA-BAG-000-SP electronic component of Melexis
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Part No.MLX75123RLA-BAG-000-SP
Manufacturer: Melexis
Category:Sensor Interface
Description: Sensor Interface Automotive ToF Companion Chip SAMPLES
Datasheet: MLX75123RLA-BAG-000-SP Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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1: USD 20.4082 ea
Line Total: USD 20.41

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MOQ: 1  Multiples: 1
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Ships to you between Wed. 19 Jun to Fri. 21 Jun

MOQ : 1
Multiples : 1
1 : USD 20.4082
5 : USD 19.7137
10 : USD 19.0833

   
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We are delighted to provide the MLX75123RLA-BAG-000-SP from our Sensor Interface category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MLX75123RLA-BAG-000-SP and other electronic components in the Sensor Interface category and beyond.

MLX75123BA Time-of-Flight Companion Chip Preliminary Datasheet All specifications subject to change without notice Features & Benefits Description Combines four high speed ADCs with a MLX75123BA is a fully integrated companion chip digital sensor control for Melexis TOF for Melexis Time-of-Flight (TOF) sensors. Its camera sensors designed for automotive and non-automotive Integrated light source control with applications, including, but not limited to, gesture modulation frequencies between recognition, in-cabin monitoring, skeleton tracking, 12-40 MHz people or obstacle detection and traffic Built-in non-volatile memory to store monitoring. customised operating start-up conditions The sensor interface is designed to connect Programmable modulation frequencies to natively with Melexis TOF sensors like MLX75023 avoid module to module crosstalk and MLX75024. The chip features a configurable Up to 8 raw phases per frame sequencer to control the TOF sensor and converts Pre-processed difference and sum output the analog sensor data via four built-in high-speed modes to reduce the data bandwidth ADCs into 12-bit per pixel image data. The image Continuous or triggered operation modes data is provided through a single ended parallel 2 2 Configurable over I C up to 400kHz camera interface. An I C interface is used to 12-bit parallel camera interface up to program the built-in non-volatile memory and to 80Mpix/s operate the system by controlling register settings. Region of interest (ROI) selection and Furthermore, as required for operation based on binning mode the lock-in principle, the MLX75123BA provides Horizontal and vertical flip/mirror modes the synchronized control signal to drive the Per-phase statistics & diagnostics modulated light source (LED or laser based). 4 general purpose outputs Combined with a Melexis TOF sensor like Ambient operating temperature ranges MLX75023 or MLX75024, the MLX75123BA offers a of -20 +85C and -40 +105C cost-effective, integrated Time-Of-Flight camera AEC-Q100 qualification available solution, supporting an image resolutions of up to 320x240 pixels (QVGA). This chipset can deliver raw TOF data up to 600 frames per second. The device is available in a compact 7x7mm AQFN package and offers a variety of integration possibilities. Figure 1 : MLX75123BA package MLX75123BA Time-of-Flight Companion Chip Preliminary Datasheet Contents Features & Benefits ................................................................................................................................... 1 Description ................................................................................................................................................ 1 1. Datasheet Changelog ............................................................................................................................. 4 2. Ordering Information ............................................................................................................................ 4 3. Application System Architecture............................................................................................................ 5 4. System Block Diagram ........................................................................................................................... 6 5. Pinout Description ................................................................................................................................. 7 1 6. Absolute Maximum Ratings .................................................................................................................. 9 7. Electrical Specifications ......................................................................................................................... 9 7.1. Crystal Oscillator Requirements ......................................................................................................... 9 7.2. Current Consumption ....................................................................................................................... 10 7.3. ADC Characteristics ........................................................................................................................... 12 8. Power Consumption ............................................................................................................................ 13 8.1. Power Up & Down Sequence ........................................................................................................... 13 8.2. Power on reset .................................................................................................................................. 14 9. Output Modes ..................................................................................................................................... 14 9.1. Mode 0: 11bit A-B + error bit .......................................................................................................... 14 9.2. Mode 1: 12bit A-B ............................................................................................................................ 15 9.3. Mode 2: 11bit A+B + error bit ......................................................................................................... 15 9.4. Mode 3: 12bit A+B ........................................................................................................................... 15 9.5. Mode 4: Raw A ................................................................................................................................. 15 9.6. Mode 5: Raw B ................................................................................................................................. 15 10. Parallel Output Sequence & Timing ................................................................................................... 16 11. Distance Calculation .......................................................................................................................... 17 12. I2C Commands .................................................................................................................................. 18 2 12.1. I C READ ......................................................................................................................................... 18 2 12.2. I C WRITE ....................................................................................................................................... 18 2 12.3. I C RESET ........................................................................................................................................ 19 2 12.4. I C GLOBAL RESET ......................................................................................................................... 19 2 12.5. I C SAVEREGMAP ........................................................................................................................... 19 13. Registers ............................................................................................................................................ 20 13.1. Configuration Parameter Registers ............................................................................................... 21 13.2. FrameTable & Phase Registers ....................................................................................................... 24 Page 2 of 47 Revision 0.4 NOV 13, 2018 All specifications subject to change without notice

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
MELEXIS
Melexis Inc
Melexis Technologies NV

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