4902P Technical Data Sheet Sn42Bi57Ag1 Low Temperature Solder Paste ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P Description The 4902P Sn42Bi57Ag1 Low Temperature Solder Paste is made for low temperature applications. It spreads and adheres well to a variety of materials and provides excellent soldering results and appearance. This uniform paste dispenses evenly and resists solder beading and bright spots. Applications & Usages The solder paste is designed to is used for LEDs and telecommunication assemblies. Benefits and Features Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B for ROM1 Particle size Type 3 (with 80% min. between 25-45 m) No-clean Excellent 12 mil (0.30 mm) fine pitch printing capability Long operational lifenon-slumping COMPLIANCE Good wettability Dobb-Frank (DRC conflict free) REACH (compliant) Halogen free RoHS (compliant) Sn42Bi57Ag1 Alloy Typical Literature Properties Physical Properties Value Color Silvery-white metal 3 Density 8.6 g/cm Electrical Properties Value Volume Resistivity 34.5 cm a) Electrical Conductivity 4.5% IACS 7 a) International Annealed Copper Standard: 100% give 5.8 10 S/m. Thermal Properties Value Melting Point, Solidus 138 C 280 F Melting Point, Liquidus 138 C 280 F Tip Temperature Upper Limit Do not exceed 425 C 800 F Page 1 of 6 Date: 24 August 2020 / Ver. 1.03 4902P Technical Data Sheet Sn42Bi57Ag1 Low Temperature Solder Paste ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 4902P Solder Alloy Composition Properties Value Properties J-STD-006C a) MAIN INGREDIENTS IMPURITIES Sn 41.5 to 42.5% Sb 0.20% Max Bi 57.5 to 58.5% In 0.10% Max Ag 0.9% to 1.1% Cu 0.08% Max Pb 0.07% Max Au 0.03% Max As 0.05% Max Fe 0.02% Max Ni 0.01% Max Al 0.005% Max Zn 0.003% Max Cd 0.002% Max a) Exceeds the requirements of J-STD-006C and meets ASTM B 32. Particle Size The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 m) particle sizes. Storage and Shelf Life The shelf life for an unopened container is 12 months at room temperature (2025 C 6877 F ) and 24 months refrigerated (210 C 3550 F ), from the date of manufacture. Store syringes in an upright position with tip down to prevent flux separation and air entrapment. Bring the paste to room temperature prior to use. To warm the refrigerated paste, let the unopened container stand for 4 hours at ambient temperature before use. For faster warm up, place the sealed container in a water bath at ambient temperature for 30 minutes. Reusing Solder Paste Reusing solder paste is not normally recommended because it typically generates more complications than it is worth. If you do decide to reuse solder paste, keep the following pointers in mind: Keep the paste tightly sealed and refrigerated when not in use. Store syringes upright position with tip down to prevent flux separation and air entrapment. Before reuse, check that the paste hasnt separated or thickened relative to its usual state. Page 2 of 6 Date: 24 August 2020 / Ver. 1.03