X-On Electronics has gained recognition as a prominent supplier of 1N6638USJANTXV/TR across the USA, India, Europe, Australia, and various other global locations. 1N6638USJANTXV/TR are a product manufactured by Microchip. We provide cost-effective solutions for 1N6638USJANTXV/TR, ensuring timely deliveries around the world.

1N6638USJANTXV/TR Microchip

1N6638USJANTXV/TR electronic component of Microchip
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Part No.1N6638USJANTXV/TR
Manufacturer: Microchip
Category: Unclassified
Description: Diode Switching 125V 0.3A 2-Pin Case B T/R
Datasheet: 1N6638USJANTXV/TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
152: USD 12.5373 ea
Line Total: USD 1905.67 
Availability - 0
MOQ: 152  Multiples: 152
Pack Size: 152
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 152
Multiples : 152
152 : USD 12.5373

   
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We are delighted to provide the 1N6638USJANTXV/TR from our Microchip manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 1N6638USJANTXV/TR and other electronic components in the Microchip manufacturer and beyond.

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1N6638US, 1N6642US, 1N6643US Qualified Levels: VOIDLESS HERMETICALLY SEALED JAN, JANTX, Available on SWITCHING DIODES JANTXV and JANS commercial versions Qualified per MIL-PRF-19500/578 DESCRIPTION This popular surface mount equivalent JEDEC registered switching/signal diodes are military qualified and available with internal metallurgical bonded construction. These small low capacitance diodes with very fast switching speeds are hermetically sealed and bonded into a D-5B package. They may be used in a variety of fast switching applications including computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, as well as decoding or encoding applications, etc. Microsemi also offers a variety of other switching/signal diodes. B SQ-MELF Important: For the latest information, visit our website 1N6638US, 1N6642US, 1N6643US MECHANICAL and PACKAGING CASE: Voidless hermetically sealed hard glass. TERMINALS: Tin-lead plate with >3% lead. Solder dip is available upon request. MARKING: Body painted and alpha numeric. POLARITY: Cathode indicated by band. Tape & Reel option: Standard per EIA-481-1-A with 12 mm tape. Consult factory for quantities. See Package Dimensions on last page. PART NOMENCLATURE JAN 1N6638 US (e3) Reliability Level RoHS Compliance JAN = JAN Level e3 = RoHS compliant (available JANTX = JANTX Level on commercial grade only) Blank = non-RoHS compliant JANTXV = JANTXV Level JANS = JANS Level Blank = commercial Surface Mount Package JEDEC type number See Electrical Characteristics table SYMBOLS & DEFINITIONS Symbol Definition VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature V RWM range. V Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. F Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and I R temperature. C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from t the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is rr reached. o ELECTRICAL CHARACTERISTICS 25 C unless otherwise noted. MAXIMUM MAXIMUM DC REVERSE CURRENT REVERSE MAXIMUM MAXIMUM FORWARD RECOVERY FORWARD JUNCTION VOLTAGE TIME RECOVERY CAPACITANCE V I t VOLTAGE AND f = 1 MHz F F rr TYPE (Note 1) TIME Vsig = 50 mV NUMBER I I I I I =200mA, t =1ns (p-p) R1 R2 R3 R4 F r V = V =V V =20 V V =V R R RWM R R RWM 20 V T = T = V t V =0 V V =1.5 V A A FRM fr R R o o +150 C +150 C V mA V mA nA nA A A ns V ns pf pf 1N6638US 0.8 V 10 mA 1.1 V 200 mA 35 500 50 100 4.5 5.0 20 2.5 2.0 1N6642US 0.8 V 10 mA 1.2 V 100 mA 25 500 50 100 5.0 5.0 20 5.0 2.8 1N6643US 0.8 V 10 mA 1.2 V 100 mA 50 500 75 100 6.0 5.0 20 5.0 2.8 NOTE: 1. Reverse Recovery Time Test Conditions I =I =10 mA, I = 1.0 mA, C=3 pF, R = 100 ohms. F R R(REC) L T4-LDS-0218-1, Rev. 1 (111513) 2011 Microsemi Corporation Page 2 of 5

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8541100080
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
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M9S
MCP
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MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
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MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
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Microsemi Corporation
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Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
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MSC
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ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
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VECTRON INTERNATIONAL
VECTRON INTL
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Vitesse / Microsemi
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