X-On Electronics has gained recognition as a prominent supplier of 25LC256-I/P EEPROM across the USA, India, Europe, Australia, and various other global locations. 25LC256-I/P EEPROM are a product manufactured by Microchip. We provide cost-effective solutions for EEPROM, ensuring timely deliveries around the world.

25LC256-I/P Microchip

Hot 25LC256-I/P electronic component of Microchip
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Part No.25LC256-I/P
Manufacturer: Microchip
Category: EEPROM
Description: Memory; EEPROM; SPI; 32kx8bit; 2.5÷5.5V; 10MHz; DIP8
Datasheet: 25LC256-I/P Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
36: USD 0.9035 ea
Line Total: USD 32.53 
Availability - 1455
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ: 36  Multiples: 1
Pack Size: 1
Availability Price Quantity
1280
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 60
Multiples : 60
60 : USD 2.1625
120 : USD 2.1
300 : USD 2.025
540 : USD 1.9875
1020 : USD 1.9
2520 : USD 1.875
5040 : USD 1.8375

1455
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 36
Multiples : 1
36 : USD 0.9035
40 : USD 0.884
100 : USD 0.858
250 : USD 0.845
500 : USD 0.806

328
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 1.76
25 : USD 1.76
120 : USD 1.694

217
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 2.562
10 : USD 2.464
19 : USD 2.45
25 : USD 2.366
120 : USD 2.352

843
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 19
Multiples : 1
19 : USD 2.2425
50 : USD 2.2263
200 : USD 2.21

217
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 30
Multiples : 1
30 : USD 3.3091

512
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 4
Multiples : 1
4 : USD 2.1372
25 : USD 2.0527
120 : USD 1.9838

349
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 60
Multiples : 60
60 : USD 2.9237
120 : USD 2.8392
300 : USD 2.7378
540 : USD 2.6871
1020 : USD 2.5688

   
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We are delighted to provide the 25LC256-I/P from our EEPROM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 25LC256-I/P and other electronic components in the EEPROM category and beyond.

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25AA256/25LC256 256K SPI Bus Serial EEPROM Device Selection Table Part Number VCC Range Page Size Temp. Ranges Packages 25LC256 2.5V-5.5V 64 Bytes I, E MF, P, SN, SM, ST 25AA256 1.8V-5.5V 64 Bytes I, E MF, P, SN, SM, ST Features Pin Function Table Maximum Clock 10 MHz Name Function Low-Power CMOS Technology: - Maximum Write current: 5 mA at 5.5V, CS Chip Select Input 10 MHz SO Serial Data Output - Read current: 6 mA at 5.5V, 10 MHz WP Write-Protect - Standby current: 1 A at 5.5V VSS Ground 32,768 x 8-Bit Organization SI Serial Data Input 64-Byte Page SCK Serial Clock Input Self-Timed Erase and Write Cycles (5 ms maximum) Hold Input HOLD Block Write Protection: VCC Supply Voltage - Protect none, 1/4, 1/2 or all of array Built-In Write Protection: Description - Power-on/off data protection circuitry The Microchip Technology Inc. 25AA256/25LC256 - Write enable latch (1) (25XX256 ) are 256-Kbit Serial Electrically Erasable - Write-protect pin PROMs. The memory is accessed via a simple Serial Sequential Read Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus High Reliability: separate data in (SI) and data out (SO) lines. Access to - Endurance: 1,000,000 erase/write cycles ) the device is controlled through a Chip Select (CS - Data retention: > 200 years input. - ESD protection: > 4000V Communication to the device can be paused via the Temperature Ranges Supported: hold pin (HOLD). While the device is paused, - Industrial (I): -40Cto +85C transitions on its inputs will be ignored, with the - Extended (E): -40C to +125C exception of Chip Select, allowing the host to service RoHS Compliant higher priority interrupts. Automotive AEC-Q100 Qualified Note 1: 25XX256 is used in this document as a generic part number for the Packages 25AA256/25LC256 devices. 8-Lead DFN-S, 8-Lead PDIP, 8-Lead SOIC, 8-Lead SOIJ and 8-Lead TSSOP Package Types (not to scale) DFN-S TSSOP Rotated TSSOP PDIP/SOIC CS 1 8 VCC CS 1 8 Vcc 8 1 8 SCK CS 1 VCC HOLD SO 2 7 HOLD 2 2 7 SO 7 HOLD VCC 2 7 SI SO HOLD WP 3 6 SCK 3 6 CS 3 6 VSS WP SCK WP 3 6 SCK VSS 4 5 SO 5 WP SI Vss 4 5 SI 4 4 VSS 5 SI 2003-2021 Microchip Technology Inc. DS20001822J-page 125AA256/25LC256 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V SS ......................................................................................................... -0.6V to VCC +1.0V All inputs and outputs w.r.t. V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature under bias.............................................................................................................-40C to +125C ESD protection on all pins..........................................................................................................................................4 kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C VCC = 1.8V to 5.5V DC CHARACTERISTICS Extended (E): TA = -40C to +125C VCC = 1.8V to 5.5V Param. Symbol Characteristic Minimum Maximum Units Test Conditions No. D001 VIH High-Level Input Voltage 0.7 VCC VCC +1 V D002 VIL -0.3 0.3 VCC VVCC2.5V Low-Level Input Voltage D003 VIL -0.3 0.2 VCC VVCC < 2.5V D004 VOL 0.4 VIOL = 2.1 mA, VCC = 4.5V Low-Level Output Voltage D005 VOL 0.2 VIOL = 1.0 mA, VCC = 2.5V High-Level Output VCC -0.5 V IOH = -400 A D006 VOH Voltage D007 ILI Input Leakage Current 1 A CS = VCC, VIN = VSS or VCC D008 ILO Output Leakage Current 1 A CS = VCC, VOUT = VSS or VCC Internal Capacitance 7 pFTA = 25C, FCLK = 1.0 MHz, D009 CINT (All Inputs and Outputs) VCC = 5.0V (Note 2) 6 mAVCC = 5.5V FCLK = 10.0 MHz SO = Open ICC D010 Read CC = 2.5V FCLK = 5.0 MHz 2.5 mAV Operating Current SO = Open 5 mAVCC = 5.5V ICC D011 Write 3 mAVCC = 2.5V = VCC = 5.5V, Inputs tied to 5 ACS VCC or VSS, +125C D012 ICCS Standby Current 1 ACS = VCC = 5.5V, Inputs tied to VCC or VSS, +85C Note 1: Typical measurements taken at room temperature (+25C). 2: This parameter is periodically sampled and not 100% tested. DS20001822J-page 2 2003-2021 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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