X-On Electronics has gained recognition as a prominent supplier of APA300-FG256 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. APA300-FG256 FPGA - Field Programmable Gate Array are a product manufactured by Microchip. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

APA300-FG256 Microchip

APA300-FG256 electronic component of Microchip
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Part No.APA300-FG256
Manufacturer: Microchip
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array ProASIC Plus
Datasheet: APA300-FG256 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 186.3204 ea
Line Total: USD 186.32 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 186.3204
10 : USD 175.2903

   
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We are delighted to provide the APA300-FG256 from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the APA300-FG256 and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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v5.9v5.9 PLUS ProASIC Flash Family FPGAs High Performance Routing Hierarchy Features and Benefits Ultra-Fast Local and Long-Line Network High-Speed Very Long-Line Network High Capacity High-Performance, Low Skew, Splittable Global Network Commercial and Industrial 100% Routability and Utilization 75,000 to 1 Million System Gates I/O 27 K to 198 Kbits of Two-Port SRAM Schmitt-Trigger Option on Every Input 66 to 712 User I/Os 2.5V/3.3V Support with Individually-Selectable Voltage and Slew Rate Military Bidirectional Global I/Os 300, 000 to 1 Million System Gates Compliance with PCI Specification Revision 2.2 72 K to 198 Kbits of Two Port SRAM Boundary-Scan Test IEEE Std. 1149.1 (JTAG) Compliant 158 to 712 User I/Os PLUS Pin-Compatible Packages across the ProASIC Family Reprogrammable Flash Technology Unique Clock Conditioning Circuitry 0.22 m 4 LM Flash-Based CMOS Process PLL with Flexible Phase, Multiply/Divide, and Delay Live At Power-Up (LAPU) Level 0 Support Capabilities Single-Chip Solution Internal and/or External Dynamic PLL Configuration No Configuration Device Required Two LVPECL Differential Pairs for Clock or Data Inputs Retains Programmed Design during Power-Down/Up Cycles Mil/Aero Devices Operate over Full Military Temperature Standard FPGA and ASIC Design Flow Range Flexibility with Choice of Industry-Standard Front-End Tools Efficient Design through Front-End Timing and Gate Performance Optimization 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military temperature) ISP Support Two Integrated PLLs In-System Programming (ISP) via JTAG Port External System Performance up to 150 MHz SRAMs and FIFOs Secure Programming SmartGen Netlist Generation Ensures Optimal Usage of The Industrys Most Effective Security Key (FlashLock ) Embedded Memory Blocks 24 SRAM and FIFO Configurations with Synchronous and Low Power Asynchronous Operation up to 150 MHz (typical) Low Impedance Flash Switches Segmented Hierarchical Routing Structure Small, Efficient, Configurable (Combinatorial or Sequential) Logic Cells PLUS Table 1 ProASIC Product Profile 1 1 1 Device APA075 APA150 APA300 APA450 APA600 APA750 APA1000 Maximum System Gates 75,000 150,000 300,000 450,000 600,000 750,000 1,000,000 Tiles (Registers) 3,072 6,144 8,192 12,288 21,504 32,768 56,320 Embedded RAM Bits (k=1,024 bits) 27 k 36k 72 k 108 k 126 k 144 k 198 k Embedded RAM Blocks (256x9) 12 16 32 48 56 64 88 LVPECL 222 2 2 2 2 PLL 222 2 2 2 2 Global Networks 4 4 4 4 4 4 4 Maximum Clocks 24 32 32 48 56 64 88 Maximum User I/Os 158 242 290 344 454 562 712 JTAG ISP Yes Yes Yes Yes Yes Yes Yes PCI Yes Yes Yes Yes Yes Yes Yes Package (by pin count) TQFP 100, 144 100 PQFP 208 208 208 208 208 208 208 PBGA 456 456 456 456 456 456 FBGA 144 144, 256 144, 256 144, 256, 484 256, 484, 676 676, 896 896, 1152 2 CQFP 208, 352 208, 352 208, 352 2 CCGA/LGA 624 624 Notes: 1. Available as Commercial/Industrial and Military/MIL-STD-883B devices. 2. These packages are available only for Military/MIL-STD-883B devices. December 2009 i 2009 Actel Corporation See the Actel website for the latest version of the datasheet.PLUS ProASIC Flash Family FPGAs Ordering Information APA1000 FG G 1152 I Application (Ambient Temperature Range) Blank = Commercial (0C to +70C) I = Industrial (40C to +85C) PP = Pre-production ES = Engineering Silicon (room temperature only) M = Military (55C to 125C) B = MIL-STD-883 Class B Package Lead Count Lead-free packaging Blank = Standard Packaging G = RoHS Compliant Packaging Package Type = TQ Thin Quad Flat Pack (0.5 mm pitch) = PQ Plastic Quad Flat Pack (0.5 mm pitch) = FG Fine Pitch Ball Grid Array (1.0 mm pitch) = BG Plastic Ball Grid Array (1.27 mm pitch) = CQ Ceramic Quad Flat Pack (1.05 mm pitch) = CG Ceramic Column Grid Array (1.27 mm pitch) = LG Land Grid Array (1.27 mm pitch) Speed Grade = Blank Standard Speed Part Number APA075 = 75,000 Equivalent System Gates APA150 = 150,000 Equivalent System Gates APA300 = 300,000 Equivalent System Gates APA450 = 450,000 Equivalent System Gates APA600 = 600,000 Equivalent System Gates APA750 = 750,000 Equivalent System Gates APA1000 = 1,000,000 Equivalent System Gates ii v5.9

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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