APT2X51DC120J Microchip

APT2X51DC120J APT2X50DC120J ISOTOP SiC Diode V = 1200V RRM I = 50A T = 100C Power Module F C Application 23 Uninterruptible Power Supply (UPS) Induction heating 2 3 Welding equipment High speed rectifiers 1 4 Features Anti-Parallel Anti-Parallel 1 4 SiC Schottky Diode AAPT2X50DC12PT2X60DC120J0J - Zero reverse recovery Parallel Parallel - Zero forward recovery APT2X51DC120J APT2X61DC120J - Temperature Independent switching behavior - Positive temperature coefficient on VF ISOTOP Package (SOT-227) Very low stray inductance High level of integration 3 2 Benefits 4 Outstanding performance at high frequency operation 1 Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant ISOTOP Absolute maximum ratings (per leg) Symbol Parameter Max ratings Unit V Maximum DC reverse Voltage R 1200 V V Maximum Peak Repetitive Reverse Voltage RRM I Maximum Average Forward Current Duty cycle = 50% T = 100C 50 F(AV) C A T = 25C I Non-Repetitive Forward Surge Current 10 s C 650 FSM These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com 1 4 www.microsemi.com APT2X51 50DC120J Rev 1 October, 2012 APT2X51DC120J APT2X50DC120J All ratings T = 25C unless otherwise specified j Electrical Characteristics (per leg) Symbol Characteristic Test Conditions Min Typ Max Unit T = 25C 1.6 1.8 j V Diode Forward Voltage I = 50A V F F T = 175C 2.3 3.0 j T = 25C 160 1000 j I Maximum Reverse Leakage Current V = 1200V A RM R T = 175C 280 5000 j I = 50A, V = 600V F R Q Total Capacitive Charge 200 nC C di/dt =2500A/s f = 1MHz, V = 200V 480 R C Total Capacitance pF f = 1MHz, V = 400V 345 R Thermal and package characteristics (per leg) Symbol Characteristic Min Typ Max Unit R Junction to Case Thermal resistance 0.32 thJC C/W R Junction to Ambient (IGBT & Diode) 20 thJA V RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 2500 V ISOL T ,T Storage Temperature Range -55 175 J STG C T Max Lead Temp for Soldering:0.063 from case for 10 sec 300 L Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) 1.5 N.m Wt Package Weight 29.2 g SOT-227 (ISOTOP ) Package Outline 11.8 (.463) 12.2 (.480) 31.5 (1.240) 31.7 (1.248) 8.9 (.350) 9.6 (.378) W=4.1 (.161) 7.8 (.307) W=4.3 (.169) 8.2 (.322) Hex Nut M4 H=4.8 (.187) (4 places) H=4.9 (.193) (4 places) 25.2 (0.992) r = 4.0 (.157) 25.4 (1.000) 4.0 (.157) 0.75 (.030) 12.6 (.496) (2 places) 4.2 (.165) 0.85 (.033) 12.8 (.504) (2 places) 3.3 (.129) 1.95 (.077) 3.6 (.143) 2.14 (.084) 14.9 (.587) 4 3 15.1 (.594) 30.1 (1.185) * Emitter terminals are shorted 30.3 (1.193) internally. Current handling capability is equal for either 38.0 (1.496) Emitter terminal. 38.2 (1.504) 2 1 Dimensions in Millimeters and (Inches) 2 4 www.microsemi.com APT2X51 50DC120J Rev 1 October, 2012