X-On Electronics has gained recognition as a prominent supplier of MSDT200-16 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. MSDT200-16 Discrete Semiconductor Modules are a product manufactured by Microchip. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

MSDT200-16 Microchip

MSDT200-16 electronic component of Microchip
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See Product Specifications
Part No.MSDT200-16
Manufacturer: Microchip
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules Power Module - Diode
Datasheet: MSDT200-16 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 157.1598 ea
Line Total: USD 157.16 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 157.1598
5 : USD 148.159
10 : USD 143.7854
30 : USD 137.0129
50 : USD 133.7296
100 : USD 130.6159
250 : USD 126.4362
500 : USD 126.4362

   
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We are delighted to provide the MSDT200-16 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MSDT200-16 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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MSDT200 Three Phase Bridge + Thyristor VRRM / VDRM 800 to 1600V IFAV / ITAV 200Amp Features Blocking voltage:800 to 1600V Three Phase Bridge and a Thyristor Circuit Low Forward Voltage - G R2 Applications Inverter for AC or DC motor control Current stablilzed power supply Switching power supply R S T UL E243882 approved Module Type TYPE VRRM / VDRM VRSM MSDT200-08 800V 900V MSDT200-12 1200V 1300V MSDT200-16 1600V 1700V Diode Maximum Ratings Symbol Item Conditions Values Units ID Output Current(D.C.) Tc=96 Three phase full wave 200 A IFSM Surge forward current t=10mS Tvj =45 1900 A 2 2 i t Circuit Fusing Consideration 18050 A s Visol Isolation Breakdown Voltage(R.M.S) a.c.50HZ r.m.s. 1min 3000 V Tvj Operating Junction Temperature -40 to +150 Tstg Storage Temperature -40 to +125 Mt Mounting Torque To terminals(M4) 215% Nm Mt To terminals(M6) 515% Nm Ms To heatsink(M6) 515% Nm Weight Module Approximately 320 g Thermal Characteristics Symbol Item Conditions Values Units Thermal Impedance, max. Junction to Case(TOTAL) 0.12 /W Rth(j-c) Rth(c-s) Thermal Impedance, max. Case to Heat sink 0.06 /W Electrical Characteristics Symbol Item Conditions Values Units VFM Forward Voltage Drop, max. T=25 IF =200A 1.45 V Tvj =25 VRD=VRRM Repetitive Peak Reverse Current, 2 mA IRRM max. 10 mA Tvj =150 VRD=VRRM Document Number: MSDT200 www.smsemi.com Sep.06,2013 1 + MSDT200 Thyristor Maximum Ratings Symbol Item Conditions Values Units Tc=93, Single Phase half wave I Average On-State Current 200 A TAV o 180 conduction TVJ=45 t=10ms (50Hz), sine I Surge On-State Current 1900 A TSM VR=0 2 2 i t Circuit Fusing Consideration 18050 A s Visol Isolation Breakdown Voltage(R.M.S) a.c.50HZ r.m.s. 1 min 3000 V Tvj Operating Junction Temperature -40 to +125 Tstg Storage Temperature -40 to +125 Mt Mounting Torque To terminals(M4) 215% Nm Mt To terminals(M6) 515% Ms To heatsink(M6) 515% Nm Critical Rate of Rise of On-State T =T , V =1/2V ,I =100mA VJ VJM D DRM G di/dt 200 A/s Current d /d =0.1A/ s iG t Critical Rate of Rise of Off-State T =T ,V =2/3V ,linear voltage J VJM D DRM dv/dt 500 V/s Voltage, min. rise Electrical and Thermal Characteristics Values Symbol Item Conditions Units Min. Typ. Max. V Peak On-State Voltage, max. 1.80 V T=25 I =600A TM T Repetitive Peak Reverse Current, T =T ,V =V ,V VJ VJM R RRM D I /I max. / Repetitive Peak Off-State 100 mA RRM DRM =V DRM Current, max. V Gate Trigger Voltage, max. 3 V T =25 , V =6V GT VJ D I Gate Trigger Current, max. T =25 , V =6V 150 mA GT VJ D Rth(j-c) Thermal Impedance, max. Junction to Case 0.14 /W Rth(c-s) Thermal Impedance, max. Case to Heatsink 0.06 /W Document Number: MSDT200 www.smsemi.com Sep.06,2013 2

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8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
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