ATSAMR21B18-MZ210PA Microchip

ATSAMR21B18-MZ210PA ATSAMR21 Smart Connect Module PRELIMINARY DATASHEET Description The ATSAMR21B18-MZ210PA is a 19.7mm x 16.3mm wireless module. It integrates an ATSAMR21E18 IC together with a serial data FLASH. The design allows a variety of mounting positions with SMT as well as TH mounting. The extended temperature range with operation up to 125C is a distinguishing feature. Features ATSAMR21 Single-chip ARM Cortex-M0+ based 32-bit Microcontroller with Low Power 2.4GHz Transceiver for IEEE 802.15.4 and ZigBee Applications with 256KB Flash and 16 I/Os Max. operating freq. 48 MHz 128-bit AES crypto engine 32-bit MAC symbol counter Temperature sensor Automatic transmission modes MX25L2006EZUK-12G 2-Mbit DataFlash Lowest cost RF front end design with PCB antenna FCC / ETSI compliant harmonic filter Single 2.7V - 3.6V supply Extended industrial temperature range -40C to 125C Easy access 2mm pin header with several alternative functions 5 GPIO 1 analog input (12-bit, 350ksps Analog-to-Digital Converter) 4 PWM outputs TWI (I2C up to 3.4MHz) SPI UART High precision 16MHz crystal oscillator Atmel-42486B-ATSAMR21B18-MZ210PA Datasheet 09/2015 Table of Contents Description 1 Features 1 Table of Contents ............................................................................................................... 2 1 Integrated Devices and Block Diagram ...................................................................... 3 1.1 Module Block Diagram .......................................................................................................................... 3 1.2 Integrated system peripherals ............................................................................................................... 3 1.2.1 Serial Flash interconnect .......................................................................................................... 3 1.2.2 Available UART interfaces ........................................................................................................ 3 1.3 RF front end .......................................................................................................................................... 4 2 Mechanical Description ............................................................................................... 5 2.1 Mechanical Dimensions ........................................................................................................................ 5 2.2 Footprint Recommendation ................................................................................................................... 5 2.2.1 Pin header mounting ................................................................................................................ 5 Surface solder mounting ....................................................................................................................... 7 3 Module pin assignment ............................................................................................... 8 3.1 Application pins ..................................................................................................................................... 8 3.2 Test points ............................................................................................................................................. 9 3.2.1 Top layer test points ................................................................................................................. 9 3.2.2 Bottom layer test points ............................................................................................................ 9 4 Electrical Characteristics .......................................................................................... 11 4.1 Absolute Maximum Ratings ................................................................................................................. 11 4.2 Recommended Operating Conditions ................................................................................................. 11 4.3 Power Consumption ............................................................................................................................ 11 4.4 Module performance data ................................................................................................................... 12 5 NV Memory Information ............................................................................................ 13 6 Boot loader ................................................................................................................ 13 7 Radio Certification ..................................................................................................... 14 7.1 United States (FCC) ............................................................................................................................ 14 7.2 Europe (ETSI) ..................................................................................................................................... 14 7.3 Industry Canada (IC) Compliance statements ..................................................................................... 15 8 Ordering Information ................................................................................................. 16 9 References ................................................................................................................. 17 10 Revision History ........................................................................................................ 17 ATSAMR21B18-MZ210PA PRELIMINARY DATASHEET 2 Atmel-42486B-ATSAMR21B18-MZ210PA Datasheet 09/2015