ATWILC1000-MR1100A DATASHEET IEEE 802.11 b/g/n Link Controller SoC Datasheet Description The Atmel ATWILC1000-MR1100A is a low-power consumption 802.11 b/g/n IoT (Internet of Things) module which is specifically optimized for low power IoT applications. The highly integrated module features small form factor (14.48 x 13.46 x 3.35mm) while fully integrating Power Amplifier, LNA, Switch, and Power Management. With seamless roaming capabilities and advanced security, it could be interoperable with various vendors 802.11b/g/n Access Points in wireless LAN. The module provides SPI and SDIO to interface to host controller. Features IEEE 802.11 b/g/n 20MHz (1x1) solution Single spatial stream in 2.4GHz ISM band Integrated PA and T/R Switch Superior Sensitivity and Range via advanced PHY signal processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Wi-Fi Direct and Soft-AP support Supports IEEE 802.11 WEP, WPA, WPA2 Security Supports China WAPI security Superior MAC throughput via hardware accelerated two-level A-MSDU/A- MPDU frame aggregation and block acknowledgement On-chip memory management engine to reduce host load 2 SPI, SDIO, UART, and I C host interfaces 2-/3-wire Bluetooth coexistence interface Operating temperature range of -40 to +85C Power save modes: <1A Deep Power Down mode typical 3.3V I/O 280A Doze mode with chip settings preserved (used for beacon monitoring) On-chip low power sleep oscillator Fast host wake-up from Doze mode by a pin or host I/O transaction Atmel-42432A-WILC1000-MR1100PA-SmartConnect-Datasheet 032015 Table of Contents 1 Ordering Information and Module Marking ................................................................ 4 2 Block Diagram ............................................................................................................. 5 3 Pin-out and Package Information ............................................................................... 5 3.1 Pin Description ...................................................................................................................................... 5 3.2 Module Outline Drawings ...................................................................................................................... 8 4 Electrical Specifications ............................................................................................. 9 4.1 Absolute Ratings ................................................................................................................................... 9 4.2 Recommended Operating Ratings ........................................................................................................ 9 5 CPU and Memory Subsystems ................................................................................. 10 5.1 Processor ............................................................................................................................................ 10 5.2 Memory Subsystem............................................................................................................................. 10 5.3 Non-Volatile Memory (eFuse) ............................................................................................................. 10 6 WLAN Subsystem ...................................................................................................... 11 6.1 MAC .............................................................................................................................................. 11 6.1.1 Features ................................................................................................................................. 11 6.1.2 Description .............................................................................................................................. 11 6.2 PHY .............................................................................................................................................. 12 6.2.1 Features ................................................................................................................................. 12 6.2.2 Description .............................................................................................................................. 12 6.3 Radio .............................................................................................................................................. 12 7 External Interfaces .................................................................................................... 14 7.1 SPI Interface ....................................................................................................................................... 14 7.1.1 Overview................................................................................................................................. 14 7.1.2 SPI Timing .............................................................................................................................. 14 7.2 UART Interface ................................................................................................................................... 16 7.3 SDIO Interface .................................................................................................................................... 16 7.3.1 Overview................................................................................................................................. 16 7.3.2 Features ................................................................................................................................. 17 7.3.3 SDIO Timing ........................................................................................................................... 17 2 7.4 I C Interface ........................................................................................................................................ 18 7.4.1 Overview................................................................................................................................. 18 2 7.4.2 I C Timing ............................................................................................................................... 18 7.5 Wi-Fi/Bluetooth Coexistence ............................................................................................................... 19 8 Power Consumption .................................................................................................. 20 8.1 Description of Device States ............................................................................................................... 20 8.2 Controlling the Device States .............................................................................................................. 20 8.3 Restrictions for Power States .............................................................................................................. 20 8.4 Power-Up/Down Sequence ................................................................................................................. 20 8.5 Digital I/O Pin Behavior during Power-up Sequences ......................................................................... 22 9 Notes on Interfacing to the ATWILC1000-MR1100 .................................................. 23 9.1 Programmable Pull-up Resistors ......................................................................................................... 23 ATWILC1000-MR1100A DATASHEET 2 2 Atmel-42432A-WILC1000-MR1100PA-SmartConnect-Datasheet 032015