X-On Electronics has gained recognition as a prominent supplier of ATWINC3400A-MU-Y RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. ATWINC3400A-MU-Y RF System on a Chip - SoC are a product manufactured by Microchip. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

ATWINC3400A-MU-Y Microchip

ATWINC3400A-MU-Y electronic component of Microchip
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Part No.ATWINC3400A-MU-Y
Manufacturer: Microchip
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC SmartConnect Chipset (WINC3400) - SmartConnect Chipset (WINC3400)
Datasheet: ATWINC3400A-MU-Y Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
490: USD 8.459 ea
Line Total: USD 4144.91 
Availability - 0
MOQ: 490  Multiples: 490
Pack Size: 490
Availability Price Quantity
0
Ship by Fri. 27 Dec to Tue. 31 Dec
MOQ : 490
Multiples : 490
490 : USD 8.459

   
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We are delighted to provide the ATWINC3400A-MU-Y from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATWINC3400A-MU-Y and other electronic components in the RF System on a Chip - SoC category and beyond.

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ATWINC3400A-MU ATWINC3400A-MU IEEE 802.11 b/g/n Network Controller with Integrated Bluetooth SoC Introduction The Microchip ATWINC3400 is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network controller with Bluetooth Low Energy. It is Bluetooth 5.0 certified and optimized for low-power and high-performance applications. The ATWINC3400 radio features fully integrated Power Amplifier (PA), Low Noise Amplifier (LNA), Switch, Power Management Unit (PMU) and integrated Flash memory for system software. The ATWINC3400 offers high integration and minimal bill of materials thereby reducing system cost. The ATWINC3400 external clock sources needed are a high-speed crystal or oscillator with 26 MHz, and a 32.768 kHz clock for sleep operation. The ATWINC3400 is available in small, 6*6mm QFN packaging. The ATWINC3400 utilizes highly optimized IEEE 802.11 and Bluetooth coexistence protocols, and provides a Serial Peripheral Interface (SPI) to interface with the host controller. Features Wi-Fi Features: IEEE 802.11 b/g/n with Single Spatial Stream (1x1), 2.4 GHz ISM Band Integrated PA and T/R Switch Superior Sensitivity and Range via Advanced PHY Signal Processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Supports Soft-AP Supports IEEE 802.11 WEP, WPA, and WPA2 Personal and WPA2 Enterprise (firmware v. 1.3.1 or later) Superior MAC Throughput through Hardware Accelerated Two-Level A-MSDU/A-MPDU Frame Aggregation and Block Acknowledgment On-Chip Memory Management Engine to Reduce the Host Load Operating Temperature Range from -40C to +85C SPI Host Interface Integrated Flash Memory for Wi-Fi and Bluetooth System Software Low Leakage On-Chip Memory for State Variables Fast AP Re-Association (150 ms) On-Chip Network Stack to Offload Host MCU Network Features: TCP, UDP, DHCP, ARP, HTTP, TLS, DNS, and SNTP Bluetooth Features: Bluetooth Low Energy 5.0 Adaptive Frequency Hopping (AFH) Superior Sensitivity and Range Datasheet DS70005390A-page 1 2020 Microchip Technology Inc. ATWINC3400A-MU Table of Contents Introduction.....................................................................................................................................................1 Features......................................................................................................................................................... 1 1. Ordering Information and IC Marking......................................................................................................4 2. Functional Overview................................................................................................................................5 2.1. Block Diagram..............................................................................................................................5 2.2. Pinout Information........................................................................................................................ 6 2.3. Pinout Description........................................................................................................................ 6 2.4. Package Description.................................................................................................................... 9 3. Clocking................................................................................................................................................ 10 3.1. Crystal Oscillator........................................................................................................................ 10 3.2. Low-Power Oscillator..................................................................................................................11 4. CPU and Memory Subsystem...............................................................................................................12 4.1. Processor................................................................................................................................... 12 4.2. Memory Subsystem....................................................................................................................12 4.3. Nonvolatile Memory (eFuse)...................................................................................................... 12 5. WLAN Subsystem................................................................................................................................. 14 5.1. MAC........................................................................................................................................... 14 5.1.1. Features.......................................................................................................................14 5.2. PHY............................................................................................................................................15 5.2.1. Features.......................................................................................................................15 6. Bluetooth Low Energy...........................................................................................................................16 7. Radio.....................................................................................................................................................17 7.1. WLAN Transmitter Performance................................................................................................ 17 7.2. WLAN Receiver Performance.................................................................................................... 18 7.3. Bluetooth Transmitter Performance............................................................................................19 7.4. Bluetooth Receiver Performance............................................................................................... 20 8. External Interfaces................................................................................................................................ 21 8.1. Interfacing with the Host Microcontroller.................................................................................... 21 2 8.2. I C Slave Interface..................................................................................................................... 22 2 8.2.1. I C Slave Timing..........................................................................................................22 8.3. SPI Slave Interface.....................................................................................................................23 8.3.1. Overview......................................................................................................................23 8.3.2. SPI Timing................................................................................................................... 23 8.4. UART Interface...........................................................................................................................25 9. Power Management..............................................................................................................................26 9.1. Power Architecture.....................................................................................................................26 9.2. Power Consumption...................................................................................................................27 9.2.1. Description of Device States........................................................................................27 DS70005390A-page 2 Datasheet 2020 Microchip Technology Inc.

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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