Application Note AC190 Ceramic Column Grid Array Table of Contents Introduction 1 CCGA Package Description . 2 Column Attach and CCGA Board-Level Reliability 4 Manufacturing Handling and Assembly 5 Daisy Chain and Mechanical Samples 8 Conclusion 8 Appendix CCGA Package Dimensioning and Assembly Parameters (reference only) . 9 PCB Reflow Reference . 14 List of Changes . 15 Introduction Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. The CCGA packages use high-temperature solder columns instead of high-temperature balls. This creates a greater standoff, providing a flexible interconnection with improved thermal characteristic, significantly increasing the thermal fatigue life of the package solder joint. Microsemi has selected the CCGA technology as part of its high-density, high I/O count hermetic package offering. A 624-pin CCGA (CG624), 1152 pin-CCGA (CG1152), and 1272-pin CCGA (CG1272) PLUS are offered for the RTAX-S, RTAX-SL, RTSX-SU, Axcelerator and ProASIC FPGA product families. Figure 1 through Figure 3 on page 2 show the top and bottom views of the CG624, CG1152, and CG1272 packages. Figure 1 CG624 Package Top and Bottom View January 2013 1 2013 Microsemi CorporationCeramic Column Grid Array Figure 2 CG1152 Package Top and Bottom View Figure 3 CG1272 Package Top and Bottom View CCGA Package Description The CCGA is a multi-layer ceramic package with attributes including: 1. Dark ceramic, same material as Microsemi s CQ208, CQ256, and CQ352 packages 2. The solder column is either 90 Pb/10 Sn or 80 Pb/20 Sn, with a copper ribbon (refer to Figure 4 and Figure 5 on page 3) attached to the ceramic substrate I/O pads via eutectic 37/63 Pb/Sn, forming a eutectic solder joint. Please see Figure 6 on page 3 for more details. 3. Wire bond interconnect used to connect silicon to package. 4. The die cavity is on the top side of the package and hermetically sealed with AuSn eutectic material. 5. The lid is connected to GND. 2