Revision 13
ProASIC3 Flash Family FPGAs
with Optional Soft ARM Support
Advanced I/O
Features and Benefits
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
High Capacity
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
15 k to 1 M System Gates Wide Range Power Supply Voltage Support per JESD8-B,
Up to 144 kbits of True Dual-Port SRAM Allowing I/Os to Operate from 2.7 V to 3.6 V
Up to 300 User I/Os Bank-Selectable I/O Voltagesup to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3V/
Reprogrammable Flash Technology
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
2.5 V / 5.0 V Input
Process
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
Instant On Level 0 Support
M-LVDS (A3P250 and above)
Single-Chip Solution
I/O Registers on Input, Output, and Enable Paths
Retains Programmed Design when Powered Off
Hot-Swappable and Cold Sparing I/Os
High Performance
Programmable Output Slew Rate and Drive Strength
350 MHz System Performance
Weak Pull-Up/-Down
3.3 V, 66 MHz 64-Bit PCI
IEEE 1149.1 (JTAG) Boundary Scan Test
In-System Programming (ISP) and Security
Pin-Compatible Packages across the ProASIC3 Family
ISP Using On-Chip 128-Bit Advanced Encryption Standard
Clock Conditioning Circuit (CCC) and PLL
(AES) Decryption (except ARM -enabled ProASIC 3 devices)
Six CCC Blocks, One with an Integrated PLL
via JTAG (IEEE 1532compliant)
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
FlashLock to Secure FPGA Contents
and External Feedback
Low Power
Wide Input Frequency Range (1.5 MHz to 350 MHz)
Core Voltage for Low Power
Embedded Memory
Support for 1.5 V-Only Systems
1 kbit of FlashROM User Nonvolatile Memory
Low-Impedance Flash Switches
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
High-Performance Routing Hierarchy
Blocks (1, 2, 4, 9, and 18 organizations)
Segmented, Hierarchical Routing and Clock Structure True Dual-Port SRAM (except 18)
ARM Processor Support in ProASIC3 FPGAs
M1 ProASIC3 DevicesARM Cortex-M1 Soft Processor
Available with or without Debug
1
ProASIC3 Devices A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
2
Cortex-M1 Devices M1A3P250 M1A3P400 M1A3P600 M1A3P1000
System Gates 15,000 30,000 60,000 125,000 250,000 400,000 600,000 1,000,000
Typical Equivalent Macrocells 128 256 512 1,024 2,048
VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576
RAM Kbits (1,024 bits) 18 36 36 54 108 144
4,608-Bit Blocks 4 8 8 12 24 32
FlashROM Kbits 11 1 1 1 1 1 1
3
Secure (AES) ISP Yes Yes Yes Yes Yes Yes
Integrated PLL in CCCs 1 1 1 1 1 1
4
VersaNet Globals 6 6 18 18 18 18 18 18
I/O Banks 22 2 2 4 4 4 4
Maximum User I/Os 49 81 96 133 157 194 235 300
Package Pins
5
QFN QN68 QN48, QN68, QN132 QN132 QN132
QN132
CS CS121
VQFP VQ100 VQ100 VQ100 VQ100
TQFP TQ144 TQ144
PQFP PQ208 PQ208 PQ208 PQ208 PQ208
5
FBGA FG144 FG144 FG144/256 FG144/256/ FG144/256/ FG144/256/
484 484 484
Notes:
1. A3P015 is not recommended for new designs.
2. Refer to the Cortex-M1 product brief for more information.
3. AES is not available for Cortex-M1 ProASIC3 devices.
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.
5. The M1A3P250 device does not support this package.
6. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs datasheet.
A3P015 and A3P030 devices do not support this feature. Supported only by A3P015 and A3P030 devices.
January 2013 I
2013 Microsemi CorporationProASIC3 Flash Family FPGAs
1
I/Os Per Package
ProASIC3
2 3 3
Devices A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Cortex-M1
3,5 3
Devices M1A3P250 M1A3P400 M1A3P600 M1A3P1000
I/O Type
Package
QN48 34
QN68 49 49
5
QN132 818084 87 19
CS121 96
VQ100 77 71 71 68 13
TQ144 91 100
PQ208 133 151 34 151 34 154 35 154 35
FG144 96 97 97 24 972597259725
5,6
FG256 157 38 178 38 177 43 177 44
6
FG484 194 38 235 60 300 74
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 FPGA Fabric Users Guide
to ensure complying with design and board migration requirements.
2. A3P015 is not recommended for new designs.
3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer to
the ProASIC3 FPGA Fabric Users Guide for position assignments of the 15 LVPECL pairs.
4. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
5. The M1A3P250 device does not support FG256 or QN132 packages.
6. FG256 and FG484 are footprint-compatible packages.
Table 1 ProASIC3 FPGAs Package Sizes Dimensions
Package CS121 QN48 QN68 QN132 VQ100 TQ144 PQ208 FG144 FG256 FG484
Length Width 6 6 6 6 8 8 8 8 14 14 20 20 28 28 13 13 17 17 23 23
(mm\mm)
Nominal Area 36 36 64 64 196 400 784 169 289 529
2
(mm )
Pitch (mm) 0.5 0.4 0.4 0.5 0.5 0.5 0.5 1.0 1.0 1.0
Height (mm) 0.99 0.90 0.90 0.75 1.00 1.40 3.40 1.45 1.60 2.23
II Revision 13
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
4
Single-Ended I/O
Differential I/O Pairs
4
Single-Ended I/O
Differential I/O Pairs
4
Single-Ended I/O
Differential I/O Pairs
4
Single-Ended I/O
Differential I/O Pairs