MCP3461/2/4 Two/Four/Eight-Channel, 153.6 ksps, Low Noise, 16-Bit Delta-Sigma ADC Features General Description One/Two/Four Differential or Two/Four/Eight The MCP3461/2/4 devices are 1/2/4-channel, 16-bit Single-Ended Input Channels Delta-Sigma Analog-to-Digital Converters (ADCs) with programmable data rate of up to 153.6 ksps. They offer 16-Bit Resolution integrated features, such as internal oscillator, Programmable Data Rate: Up to 153.6 ksps temperature sensor and burnout sensor detection, in Programmable Gain: 0.33x to 64x order to reduce system component count and total 97.2 dB SINAD, -116 dBc THD, 120 dBc SFDR solution cost. (Gain = 1x, 4800 SPS) The MCP3461/2/4 ADCs are fully configurable with Low-Temperature Drift: Oversampling Ratio (OSR) from 32 to 98304 and gain - Offset error drift: 4/Gain nV/C (AZ MUX = 1) from 1/3x to 64x. These devices include an internal - Gain error drift: 0.5 ppm/C (Gain = 1x) sequencer (SCAN mode) with multiple monitor channels and a 24-bit timer to be able to automatically Low Noise: 3.2 V (Gain = 16x, 9600 SPS) RMS create conversion loop sequences without needing RMS ENOB: 15.5 Bits Minimum (All gains, all MCU communications. Advanced security features, OSR combinations) such as CRC and register map lock, can ensure config- Wide Input Voltage Range: 0V to AV DD uration locking and integrity, as well as communication Differential Voltage Reference Inputs data integrity for secure environments. Internal Oscillator or External Clock Selection These devices come with a 20 MHz SPI-compatible Ultra-Low Full Shutdown Current Consumption serial interface. Communication is largely simplified (< 5 A) with 8-bit commands, including various continuous Internal Temperature Sensor Read/Write modes and 16/32-bit multiple data formats Burnout Current Sources for Sensor Open/Short that can be accessed by the Direct Memory Access Detection (DMA) of an 8-bit, 16-bit or 32-bit MCU. 16-Bit Digital Offset and Gain Error Calibration The MCP3461/2/4 devices are available in a leaded Registers 20-lead TSSOP package, as well as in an ultra-small Internal Conversions Sequencer (SCAN Mode) 3mm x 3 mm 20-lead UQFN package and are for Automatic Multiplexing specified over an extended temperature range, from -40C to +125C. Dedicated IRQ Pin for Easy Synchronization Advanced Security Features: Applications - 16-bit CRC for secure SPI communications - 16-bit CRC and IRQ for securing Precision Sensor Transducers and Transmitters: configuration Pressure, Strain, Flow and Force Measurement - Register map lock with 8-bit secure key Factory Automation and Process Controls - Monitor controls for system diagnostics Portable Instrumentation 20 MHz SPI-Compatible Interface with Mode 0,0 Temperature Measurements and 1,1 AV : 2.7V-3.6V DD DV : 1.8V-3.6V DD Extended Temperature Range: -40C to +125C Package: 3 mm x 3 mm 20-Lead UQFN and 6.4 mm x 6.4 mm 20-Lead TSSOP 2019-2020 Microchip Technology Inc. DS20006180B-page 1MCP3461/2/4 Package Types Package Type for All Devices: 20-Lead UQFN (3 mm x 3 mm)* A. MCP3461: Single Channel Device 20 19 18 17 16 REFIN- 1 IRQ/MDAT 15 REFIN+ 2 14 SDO EP CH0 3 13 SDI 21 CH1 4 12 SCK NC 5 11 CS 67 8 910 B. MCP3462: Dual Channel Device 20 19 18 17 16 REFIN- 1 15 IRQ/MDAT REFIN+ 2 14 SDO EP CH0 3 13 SDI 21 4 CH1 12 SCK CH2 5 11 CS 6 78 9 10 C. MCP3464: Quad Channel Device 17 20 19 18 16 REFIN- 1 IRQ/MDAT 15 REFIN+ 2 14 SDO EP 3 CH0 13 SDI 21 CH1 4 12 SCK CH2 5 11 CS 67 8 910 *Includes Exposed Thermal Pad (EP) see Table 3-1. DS20006180B-page 2 2019-2020 Microchip Technology Inc. A CH3 A A CH3 NC GND GND GND NC AV CH4 AV NC AV DD DD DD DV NC DV CH5 NC DV DD DD DD D CH6 D NC NC D GND GND GND MCLK CH7 NC MCLK MCLK NC