MCP3461/2/4
Two/Four/Eight-Channel, 153.6 ksps, Low Noise,
16-Bit Delta-Sigma ADC
Features General Description
One/Two/Four Differential or Two/Four/Eight The MCP3461/2/4 devices are 1/2/4-channel, 16-bit
Single-Ended Input Channels Delta-Sigma Analog-to-Digital Converters (ADCs) with
programmable data rate of up to 153.6 ksps. They offer
16-Bit Resolution
integrated features, such as internal oscillator,
Programmable Data Rate: Up to 153.6 ksps
temperature sensor and burnout sensor detection, in
Programmable Gain: 0.33x to 64x
order to reduce system component count and total
97.2 dB SINAD, -116 dBc THD, 120 dBc SFDR
solution cost.
(Gain = 1x, 4800 SPS)
The MCP3461/2/4 ADCs are fully configurable with
Low-Temperature Drift:
Oversampling Ratio (OSR) from 32 to 98304 and gain
- Offset error drift: 4/Gain nV/C (AZ_MUX = 1)
from 1/3x to 64x. These devices include an internal
- Gain error drift: 0.5 ppm/C (Gain = 1x)
sequencer (SCAN mode) with multiple monitor
channels and a 24-bit timer to be able to automatically
Low Noise: 3.2 V (Gain = 16x, 9600 SPS)
RMS
create conversion loop sequences without needing
RMS ENOB: 15.5 Bits Minimum (All gains, all
MCU communications. Advanced security features,
OSR combinations)
such as CRC and register map lock, can ensure config-
Wide Input Voltage Range: 0V to AV
DD
uration locking and integrity, as well as communication
Differential Voltage Reference Inputs
data integrity for secure environments.
Internal Oscillator or External Clock Selection
These devices come with a 20 MHz SPI-compatible
Ultra-Low Full Shutdown Current Consumption
serial interface. Communication is largely simplified
(< 5 A)
with 8-bit commands, including various continuous
Internal Temperature Sensor
Read/Write modes and 16/32-bit multiple data formats
Burnout Current Sources for Sensor Open/Short that can be accessed by the Direct Memory Access
Detection (DMA) of an 8-bit, 16-bit or 32-bit MCU.
16-Bit Digital Offset and Gain Error Calibration
The MCP3461/2/4 devices are available in a leaded
Registers
20-lead TSSOP package, as well as in an ultra-small
Internal Conversions Sequencer (SCAN Mode) 3mm x 3 mm 20-lead UQFN package and are
for Automatic Multiplexing specified over an extended temperature range, from
-40C to +125C.
Dedicated IRQ Pin for Easy Synchronization
Advanced Security Features:
Applications
- 16-bit CRC for secure SPI communications
- 16-bit CRC and IRQ for securing
Precision Sensor Transducers and Transmitters:
configuration
Pressure, Strain, Flow and Force Measurement
- Register map lock with 8-bit secure key
Factory Automation and Process Controls
- Monitor controls for system diagnostics
Portable Instrumentation
20 MHz SPI-Compatible Interface with Mode 0,0
Temperature Measurements
and 1,1
AV : 2.7V-3.6V
DD
DV : 1.8V-3.6V
DD
Extended Temperature Range: -40C to +125C
Package: 3 mm x 3 mm 20-Lead UQFN and
6.4 mm x 6.4 mm 20-Lead TSSOP
2019-2020 Microchip Technology Inc. DS20006180B-page 1MCP3461/2/4
Package Types
Package Type for All Devices: 20-Lead UQFN (3 mm x 3 mm)*
A. MCP3461: Single Channel Device
20 19 18 17 16
REFIN- 1 IRQ/MDAT
15
REFIN+ 2
14 SDO
EP
CH0 3
13 SDI
21
CH1 4 12 SCK
NC 5 11 CS
67 8 910
B. MCP3462: Dual Channel Device
20 19 18 17 16
REFIN- 1
15 IRQ/MDAT
REFIN+ 2 14 SDO
EP
CH0 3 13 SDI
21
4
CH1 12 SCK
CH2 5
11 CS
6 78 9 10
C. MCP3464: Quad Channel Device
17
20 19 18 16
REFIN-
1 IRQ/MDAT
15
REFIN+ 2
14 SDO
EP
3
CH0 13 SDI
21
CH1 4 12 SCK
CH2 5 11 CS
67 8 910
*Includes Exposed Thermal Pad (EP); see Table 3-1.
DS20006180B-page 2 2019-2020 Microchip Technology Inc.
A CH3 A A
CH3 NC
GND GND GND
NC AV
CH4 AV NC AV
DD DD DD
DV NC DV
CH5 NC DV
DD DD
DD
D
CH6 D NC NC D
GND GND
GND
MCLK
CH7 NC MCLK MCLK
NC