X-On Electronics has gained recognition as a prominent supplier of MMA017AA RF Amplifier across the USA, India, Europe, Australia, and various other global locations. MMA017AA RF Amplifier are a product manufactured by Microchip. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

MMA017AA Microchip

MMA017AA electronic component of Microchip
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Part No.MMA017AA
Manufacturer: Microchip
Category: RF Amplifier
Description: RF Amplifier MMIC Amplifier - 2-16GHz
Datasheet: MMA017AA Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 28.06
25 : USD 24.2296
50 : USD 23.3165
75 : USD 22.1362
225 : USD 21.5127
5025 : USD 21.5127
N/A

Obsolete
   
Manufacturer
Product Category
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Minimum Operating Temperature
Maximum Operating Temperature
Operating Supply Current
Brand
Number Of Channels
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MMA017AA from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MMA017AA and other electronic components in the RF Amplifier category and beyond.

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MMA017AA 2-16GHz, Power-Selectable Wideband Amplifier Features Power-selectable from 7 to 18dBm P by 1dB choosing bond option Gain varies <1.2dB from -40C to +85C Gain of ~10-14dB and ~28dBm OIP3 at the highest power option Self-biased with single positive supply Input and Output matched to 50 0.76mm x 0.66mm x 0.1mm die size Applications Instrumentation Electronic warfare Microwave communications Radar Gain & Return Loss S over Bond Option 21 1 RF Specifications (CW, Typical Device, RF Probe): T = 25C, V = 4V A DD Bond Option ID Gain P1dB OIP3 None 95 11.5 18.0 26.0 R1 to Ground 65 10.8 15.5 23.5 est R2 to Ground 36 9.0 7.5 15.5 est R3 to Ground 23 8.0 5.5 13.5 est 1 Device is intended for small-signal applications only MM-PDS-0009 Rev A 1 of 11 Subject to Change Without Notice MMA017AA Table 1: Absolute Maximum Ratings, Not Simultaneous Parameter Value Units Drain Voltage (V ) +4.5 V D Input Power (P ) +19 dBm IN 2 Operating Channel Temperature 175 C Caution, ESD Operating Ambient Temperature (T ) -55 to +85 C A Sensitive Device Storage Temperature -65 to 150 C Thermal Resistasnce, Channel to Die Backside 150 C/W 2 7 MTTF ~ 10 hours at T = 175C. Device is intended for small-signal applications only channel Note: Bare die is non-hermetic recommend to use in an environmentally sealed package. Table 2: Specifications (CW, 100% Test): T = 25C, V = 4V A DD Parameter Min Typ Max Units I , bond option = none 45 95 135 mA DD 3 RF Probe Measurement Set-Up With Reference Planes 1mil Au wire used for 1mil Au wire used for all bonds all bonds 1000pF Capacitor Microsemi GC821K0-00 MINIMIZE GAP MINIMIZE GAP 4 5 4 5 6 6 3 7 3 7 RFOUT RFOUT RFIN RFIN 2 8 2 8 1 1 11 10 9 11 10 9 50 TRANSMISSION LINE 50 TRANSMISSION LINENon Bond OptionR2 Bond Option To use the none bonding option, attach the die directly to the baseplate. To use the R1, R2 or R3 bonding options, mount the die on top of a capacitor to float the source and bond the appropriate pad to ground. 3 Reference planes are the same for S-parameter files downloadable on www.microsemi.com/mmics MM-PDS-0009 Rev A 2 of 11 Subject to Change Without Notice

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
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MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
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Microchip / Microsemi
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Microchip Tech
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Microchip Technology Micrel
Microchip Technology / Atmel
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MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
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Microsemi Power Products Group
Microsemi SoC
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MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
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SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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