PL610 Series 1.8V to 3.3V XO ICs for 312.5kHz to 60MHz, with Standby FEATURES DESCRIPTION Single IC to cover up to 60MHz output frequency. The PL610 Series is a family of high performance general purpose oscillators to cover outputs from Direct oscillation operation 312.5KHz up to 60MHz. Designed to fit in a small Input Frequency: Fundamental crystal: 2.0x1.6mm, or larger substrates, the PL610 Series o 10MHz to 60MHz offers the best phase noise and jitter performance, Output Frequency: LVCMOS smallest die size, and lowest power consumption of o 312.5KHz to 60MHz (2.5V & 3.3V) any comparable IC. With its Standby function, the o 312.5KHz to 40MHz (1.8V) PL610 family of products draw <5A. 3 pad layout options o PL610Ax series: for Flip Chip bonding o PL610Bx series: for wire bonding Type1 o PL610Cx series: for wire bonding Type2 Integrated Automatic Level Control (ALC) to maintain constant drive level 15pF output drive capability Very low Jitter and Phase Noise High impedance standby function, <5uA Low current consumption Single 1.8V to 3.3V 10% power supply Operating temperature range from -40 C to 85 C BLOCK DIAGRAM /1, /2, /4, /8, /16, XT XTAL /32, /64 Q XTN OSC INHN 600um 600um 600um 1 6 1 6 1 6 XTN XT XT XTN XTN XT INHN VDD 2 5 INHN 2 5 VSS 2 5 INHN VDD PL610Ax PL610Bx PL610Cx Q 3 VSS VSS 3 Q Q 3 VDD 4 4 4 Note: denotes internal pull up Note: denotes internal pull up Note: denotes internal pull up PAD ASSIGNMENT (Pad locations are measured from the center of the die) Micrel Inc. 2180 Fortune Drive San Jose, CA 95131 USA tel +1(408) 944-0800 fax +1(408) 474-1000 www.micrel.com Rev 3/1/11 Page 1 650um 650um 650um PL610 Series 1.8V to 3.3V XO ICs for 312.5kHz to 60MHz, with Standby Pad Name Pad Center* Pad PL610Ax PL610Bx PL610Cx X Y 1 XTN XT XTN -177 231 2 VDD INHN VSS -215 41 3 Q VSS Q -215 -186 4 VSS Q VDD 215 -186 5 INHN VDD INHN 215 41 6 XT XTN XT 177 231 PAD DESCRIPTION DIE SPECIFICATION Pad Parameter Value Description Name Chip size 0.65x 0.60mm XT Crystal input pad Chip thickness 130um, 15um VSS GND connection Pad size 90m Q Clock output Chip base GND level VDD VDD connection Optional Die back coating Output control input. When activated (see ordering information) (Logic 0) INHN will Tristate (HiZ), INHN disabling the oscillator and the output. 10M internal pull up resistor. XTN Crystal output pad PL610 Series Configurations Output Cload Operating Pad Drive (pF) F F /2 F /4 F /8 F /16 F /32 F /64 XT XT XT XT XT XT XT Voltage Layout (mA) Flip Chip Bonding PL610A1 PL610A2 PL610A3 PL610A4 PL610A5 PL610A6 PL610A7 1.8V to Wire 3.3V 8 8 Bonding PL610B1 PL610B2 PL610B3 PL610B4 PL610B5 PL610B6 PL610B7 (10% ) Type 1 Wire Bonding PL610C1 PL610C2 PL610C3 PL610C4 PL610C5 PL610C6 PL610C7 Type 2 *Please contact Micrel sales for individual IC availability Micrel Inc. 2180 Fortune Drive San Jose, CA 95131 USA tel +1(408) 944-0800 fax +1(408) 474-1000 www.micrel.com Rev 3/1/11 Page 2