SST12LP22 2.4 GHz High-Linearity, High-Efficiency Power Amplifier Features 1.0 PRODUCT DESCRIPTION High Gain: SST12LP22 power amplifier (PA) is based on the - Typically 27.5 dB gain across 2.42.5 GHz highly-reliable InGaP/GaAs HBT technology. - Stable gain over temperature -40C to +85C This PA can be easily configured for power applications Linear output power: that require high power-added efficiency while operat- ing over the 2.4-2.5 GHz frequency band. It typically - Meets 802.11g OFDM spectrum mask require- provides 27.5 dB gain with 33% power-added effi- ment up to 22 dBm = 22 dBm for 802.11b/g. ciency P - Typically 19 dBm with <3% EVM, 802.11g, OUT 54 Mbps, 110 mA current SST12LP22 has excellent linearity, typically 19 dBm at - Typically 17.5 dBm with <2.5% EVM, 802.11n, 3% EVM with 54 Mbps 802.11g operation with MCS9, MCS7-HT20, 50% duty cycle 256 QAM modulation it provides 16.5 dBm at 1.75% - Typically 16.5 dBm with <1.75% EVM, MCS9- EVM. SST12LP22 also has a single-ended power HT40, 50% duty cycle detector which lowers the users cost for power control. - Meets 802.11b ACPR requirement up to 22 dBm The power amplifier IC also features easy board-level with 33% power-added efficiency usage along with high-speed power-up/-down control. High-speed power-up/down SST12LP22 is offered in 16-contact UQFN package - Turn on/off time (10%-90%) <100 ns and is pin-to-pin compatible to the SST12CP21 high- 10:1 VSWR survivability (unconditionally stable power amplifier. See Figure 3-1 for pin assignments up to 25 dBm) and Table 3-1 for pin descriptions. On-chip power detection - >20 dB dynamic range - VSWR- and temperature-insensitive Simple input/output matching Packages available - 16-contact UQFN (3mm x 3mm) All non-Pb (lead-free) devices are RoHS compli- ant Applications WLAN (IEEE 802.11b/g/n) WLAN 256 QAM Cordless phones 2.4 GHz ISM wireless equipment Bluetooth 2014 Microchip Technology Inc. Preliminary DS70005206A-page 1SST12LP22 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: