VSC8541RT Radiation-Tolerant Single Port Gigabit Ethernet Copper PHY with GMII/RGMII/MII/RMII Interfaces OVERVIEW The VSC8541RT device is a single port Gigabit Ethernet copper PHY targeting space-constrained 10/100/1000BASE-T applications. It is designed to withstand the harsh environment with . It features integrated line-side termination to con- serve board space, lower EMI, and improve system performance. Additionally, integrated RGMII timing compensation eliminates the need for on-board delay lines. Microchips EcoEthernet v2.0 technology supports IEEE 802.3az Energy-Efficient Ethernet (EEE) and power-saving features to reduce power based on link state and cable reach. VSC8541RT device optimizes power consumption in all link operating speeds and features a Wake-on-LAN (WoL) power management mechanism for bringing the PHY out of a low-power state using designated magic packets. Fast link failure (FLF) indication for high availability networks identifies the onset of a link failure in less than 1 ms typical to go beyond the IEEE 802.3 standard requirement of 750 ms 10 ms (link master). Potential link failure events can be more flexibly monitored using an enhanced FLF2 state machine, which goes beyond FLF indication by enabling signal- ing of the link potentially going down within 10 s. The device includes recovered clock output for Synchronous Ethernet applications. Programmable clock squelch con- trol is included to inhibit undesirable clocks from propagating and to help prevent timing loops. Ring Resiliency allows a PHY port to switch between master and slave timing references with no link drop in 1000BASE-T mode. The following illustration shows a high-level, general view of a typical VSC8541RT application. APPLICATION DIAGRAM VSC8541RT FEATURES Superior PHY and Interface Technology Integrated 10/100/1000BASE-T Ethernet copper transceiver (IEEE 802.3ab compliant) with the industrys only non-TDR-based VeriPHY cable diagnostics algorithm Patented line driver with low EMI voltage mode architecture and integrated line-side termination resistors Wake-on-LAN using magic packets HP Auto-MDIX and manual MDI/MDIX support RGMII/GMII/MII/RMII MAC interface Jumbo frame support up to 16 kilobytes with programmable synchronization FIFOs Synchronous Ethernet and IEEE 1588 Time Stamp Support Recovered clock output with programmable clock squelch control for G.8261 Synchronous Ethernet applications 1000BASE-T Ring Resiliency feature to switch between master and slave timing without dropping link Clock output squelch to inhibit clocks during auto-negotiation and no link status 2020 Microchip Technology Inc. DS60001602B-page 1VSC8541RT Clause 45 registers to support IEEE 802.3bf IEEE 1588 Start of Frame (SOF) detection to enhance 1588v2 PTP time stamp accuracy Fast Link Up/Link Drop Modes Fast link failure indication (<1 ms typical, programmable down to <10 s) Supports 1000Base-T forced mode for both master and slave end point configurations with constant link self-mon- itoring and link auto-reset should the link come down Best-in-Class Power Consumption EcoEthernet v2.0 green energy efficiency with ActiPHY, PerfectReach, and IEEE 802.3az Energy-Efficient Ethernet Fully optimized power consumption for all link speeds Clause 45 registers to support Energy-Efficient Ethernet Key Specifications Compliant with IEEE 802.3 (10BASE-T, 100BASE-TX, and 1000BASE-T) specifications Supports R/G/MII Supports a variety of clock sources: 25 MHz Xtal, 25 MHz OSC, 50 MHz OSC, 125 MHz OSC Supports programmable output frequencies of 25 MHz, 50 MHz, or 125 MHz, regardless of chosen Xtal or OSC frequencies Supports a wide array of stand-alone hardware configuration options Supports all 5 bits of MDIO/MDC addressing possible for managed mode designs using pull-up/pull-down resis- tors Low alpha mold compound (VQFN68 only) Optionally reports if a link partner is requesting inline Power-over-Ethernet (PoE and PoE+) Operating Range Supply Voltage: - Core: 1V (0.95V-1.05V) - Analog Circuits: 2.5V (2.38V-2.62V) - RGMII V1.3 and V2.0 (without HSTL support), GMII/MII, RMII V1.2: supports 1.5V (1.425V-1.575V), 1.8V (1.71V-1.89V), 2.5V (2.38V-2.62V) and 3.3V (3.135V-3.465V) Temperature: 55 C to 125 C ambient Packages VQFN68, 68-lead VQFN, 8 mm x 8 mm body size, 0.4 mm pin pitch and 0.9 mm maximum height CQFP68, 68-lead CQFP, 13.05 mm x 13.05 mm body size, 0.635 mm pin pitch and 3.68 mm maximum height ESD HBM: 2000V CDM: - VQFN68: 1000V - CQFP68: 500V Radiation Performances 2 /mg 125C No Single Event Latch-up below a LET of 78 MeV.cm TID immunity successfully tested up to 100 Krad(si) according to ESCC-22900 test method. Mass VQFN68: 154 mg CQFP68: - With bended lead cut at 2 mm from edge: 2.008g - With tie bars: 7.343g DS60001602B-page 2 2020 Microchip Technology Inc.