BAP50-03 Features Lead Free Finish/RoHS Compliant Suffix Designates RoHS Compliant. See Ordering Information) General Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 Purpose Pin Diodes Low Diode Capacitance 200mW Low Diode Forward Resistance Halogen Free.Gree Device (Note 1) Maximum Ratings Operating Junction Temperature Range: -65C to +150C Storage Temperature Range: -65C to +150C SOD-323 Thermal Resistance: 85C/W Junction to Ambient A Parameter Symbol Limits Unit B Continuous Reverse Voltage V V R 50 C E Forward Current 50 mA I F o 200 mW P Power Dissipation(T =90 C) D Cathode Mark A H Note: 1. Halogen freeGreen products are defined as those which contain <900ppm bromine, D <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. G J DIMENSIONS INCHES MM Device MarkingA81 DIM NOTE MIN MAX MIN MAX A 0.090 0.107 2.30 2.70 B 0.063 0.071 1.60 1.80 C 0.045 0.053 1.15 1.35 D 0.031 0.045 0.80 1.15 E 0.010 0.016 0.25 0.40 G 0.004 0.018 0.10 0.45 H 0.004 0.010 0.10 0.25 J ----- 0.006 ----- 0.15 SUGGESTED SOLDER PAD LAYOUT 1.88mm 0.69mm 0.56mm Rev.3-3-12012020 1/4 MCCSEMI.COMBAP50-03 Electrical Characteristics 25C Unless Otherwise Specified Conditions Parameter Symbol Max. Min. Continuous Reverse Voltage V 50V I =10A R R Forward Voltage V I =50mA 1.1V F F Reverse Current I 100nA V =50V R R V =0V,f=1MHz C 0.91pF R d1 Diode Capacitance V =1V,f=1MHz C 0.55pF R d2 V =5V,f=1MHz C 0.35pF R d3 R 40 I =0.5mA,f=100MHz Note 2 F D Diode Forward Resistance I =1.0mA,f=100MHz Note 2 R 25 D F R 5 I =10mA,f=100MHz Note 2 F D Note 2. Guaranteed on AQL basis: inspection level S4,AQL 1.0. Rev.3-3-12012020 2/4 MCCSEMI.COM