SM5819PL-TPS06 Micro Commercial Components (MCC)

M C C SM5817PL R
  omponents 20736 Marilla Street Chatsworth Micro Commercial Components THRU         SM5819PL Features Halogen free available upon request by adding suffix-H Schottky Barrier High-Surge-Capability Low Forward Voltage Diodes Low-Profile-Package Lead Free Finish/RoHS Compliant(Note 1) Suffix designates RoHS Compliant. See ordering information) 20 to 40 Volts Mechanical Data Packaging: SOD-123FL Epoxy meets UL 94 V-0 flammability rating SOD-123FL Moisture Sensitivity Level 1 Marking Code: SM5817PL---K2;SM5818PL---K3 ; SM5819PL---K4 A B Maximum Ratings Symbol Rating Rating Unit C E Maximum RMS Voltage SM5817PL 14 V RMS SM5818PL 21 V 28 SM5819PL SM5817PL 20 Repetitive Reverse Voltage V SM5818PL 30 V RRM SM5819PL 40 H D SM5817PL 20 V V DC DC Blocking Voltage SM5818PL 30 SM5819PL 40 Rectified Current (Average) Half Wave G I Rectification with Resist. Load at 1.0 A F(AV) DIMENSIONS O TL=90 C DIM INCHES MM NOTE I Repetitive Peak Forward Current 1.2(Min) 1.5(Max) FRM A MIN MAX MIN MAX I Surge Forward Current at t=8.3ms 30 A FSM A .140 .152 3.55 3.85 O B .100 .122 2.55 3.10 RthJA 88 C/W O 43 C/W RthJC Typical Thermal Resistance(Note2) C .055 .075 1.40 1.90 O 30 C/W RthJL D .035 .053 0.90 1.35 P Power Dissipation 1.14 W D E .020 .041 0.50 1.05 O T Junction Temperature -65 to +125 C J G .010 ----- 0.25 ----- O T Storage Temperature -65 to +125 C STG H ----- .010 ---- .25 O Electrical Characteristics @ 25 C Unless Otherwise Specified SUGGESTED SOLDER Symbol Parameter Min Typ Max Units PAD LAYOUT Forward Voltage (@IF=1A ) SM5817PL --- --- 0.45 0.093 --- --- 0.53 (@IF=1A) SM 5818PL ~5819PL V F V --- --- 0.375 (@IF=0.1A ) SM5818PL~ 5819PL 0.45 --- --- (@IF=0.5A ) SM5818PL~ 5819PL 0.048 O --- --- 0.1 mA Leakage Current@VR @TA=25 C O mA I @TA=100 C --- --- 9.0 R A (@VR=15V) SM5818PL~ 5819PL --- 20 --- 0.036 Typical--Junction--Capacitance C 50 --- pF j --- @f=1.0MHz,Vr=4V Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Anne 7a 2. Thermal Resistence : PC Board Mounted on 0.2*0.2"(5*5mm) copper pad area. www.mccsemi.com 1 of 4 Revision: L 2017/11/06M C C SM5817PL-SM5819PL R Micro Commercial Components FIG2: Surge Forward Current Capability FIG1: TYPICAL FORWARD CURRENT 35 1.0 30 8.3ms Single Half Sine Wave JEDEC Method 0.75 25 20 15 0.25 10 0 5 0 20 40 60 80 100 120 140 0 1 2 5 10 20 50 100 LEAD TEMPERATURE () Number of Cycles FIG3: Instantaneous Forward Voltage FIG4: Instantaneous Forward Voltage 5 5 IF(A) IF(A) SM5817PL SM5818PL and SM5819PL TJ= 100C T =25C TJ= 100C J T =25C J 1 1 0.1 0.1 0.01 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VF(V) VF(V) www.mccsemi.com 2 of 4 Revision: L 2017/11/06 AVERAGE FORWARD RECTIFIED CURRENT AMPERES Peak Forward Surge CurrentA