128Mb, 1.8V Multiple I/O Serial Flash Memory
Features
Micron Serial NOR Flash Memory
1.8V, Multiple I/O, 4KB, 32KB, 64KB, Sector Erase
MT25QU128ABA
Options Marking
Features
Voltage
SPI-compatible serial bus interface
1.72.0V U
Single and double transfer rate (STR/DTR)
Density
Clock frequency
128Mb 128
166 MHz (MAX) for all protocols in STR
Device stacking
90 MHz (MAX) for all protocols in DTR
Monolithic A
Dual/quad I/O commands for increased through-
Device generation B
put up to 90 MB/s
Die revision A
Supported protocols in both STR and DTR
Pin configuration
Extended I/O protocol
RESET# and HOLD# 8
Dual I/O protocol
Sector Size
Quad I/O protocol
64KB E
Execute-in-place (XIP)
Packages JEDEC-standard, RoHS-
PROGRAM/ERASE SUSPEND operations
compliant
Volatile and nonvolatile configuration settings
24-ball T-PBGA, 05/6mm x 8mm (5 x 12
Software reset
5 array)
Additional reset pin for selected part numbers
24-ball T-PBGA 05/6mm x 8mm (4 x 14
Dedicated 64-byte OTP area outside main memory
6 array)
Readable and user-lockable
Wafer level chip-scale package,15 54
Permanent lock with PROGRAM OTP command
balls , 9 active balls (XFWLBGA 0.5P)
Erase capability
8-pin SOP2, 208 mils body width SE
Bulk erase
(SO8W)
Sector erase 64KB uniform granularity
16-pin SOP2, 300 mils body width SF
Subsector erase 4KB, 32KB granularity
(SO16W)
Security and write protection
W-PDFN-8 6mm x 5mm (MLP8 6mm W7
Volatile and nonvolatile locking and software
x 5mm)
write protection for each 64KB sector
W-PDFN-8 8mm x 6mm (MLP8 8mm W9
Nonvolatile configuration locking
x 6mm)
Password protection
Standard security 0
Hardware write protection: nonvolatile bits
Special options
(BP[3:0] and TB) define protected area size
Standard S
Program/erase protection during power-up
Automotive A
CRC detects accidental changes to raw data
Operating temperature range
Electronic signature
From 40C to +85C IT
JEDEC-standard 3-byte signature (BA18h)
From 40C to +105C AT
Extended device ID: two additional bytes identify
device factory options
JESD47H-compliant
Minimum 100,000 ERASE cycles per sector
Data retention: 20 years (TYP)
PDF: 09005aef85830b66 Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
mt25q_qlhs_U_128_ABA_xxT.pdf - Rev. I 05/17 EN 2014 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.128Mb, 1.8V Multiple I/O Serial Flash Memory
Features
Part Number Ordering
Micron Serial NOR Flash devices are available in different configurations and densities. Verify valid part numbers
by using Microns part catalog search at www.micron.com. To compare features and specifications by device type,
visit www.micron.com/products. Contact the factory for devices not found.
Figure 1: Part Number Ordering Information
MT 25Q L xxx A BA 1 E SF - 0 S IT ES
Micron Technology Production Status
Blank = Production
Part Family ES = Engineering samples
25Q = SPI NOR QS = Qualification samples
Voltage Operating Temperature
L = 2.73.6V IT = 40C to +85C
U = 1.72.0V AT = 40C to +105C
Density Special Options
064 = 64Mb (8MB) S = Standard
128 = 128Mb (16MB) A = Automotive grade AEC-Q100
256 = 256Mb (32MB)
512 = 512Mb (64MB) Security Features
01G = 1Gb (128MB) 0 = Standard default security
02G = 2Gb (256MB)
Package Codes
Stack 12 = 24-ball T-PBGA, 05/6 x 8mm (5 x 5 array)
A = 1 die/1 S# 14 = 24-ball T-PBGA, 05/6 x 8mm (4 x 6 array)
B = 2 die/1 S# SC = 8-pin SOP2, 150 mil
C = 4 die/1 S# SE = 8-pin SOP2, 208 mil
SF = 16-pin SOP2, 300 mil
Device Generation W7 = 8-pin W-PDFN, 6 x 5mm
B = 2nd generation W9 = 8-pin W-PDFN, 8 x 6mm
1
5x = WLCSP package
Die Revision
A = Rev. A Sector size
B = Rev. B E = 64KB sectors, 4KB and 32KB sub-sectors
Pin Configuration Option
1 = HOLD# pin
3 = RESET# pin
8 = RESET# & HOLD# pin
Note: 1. WLCSP package codes, package size, and
availability are density-specific. Contact the
factory for availability.
PDF: 09005aef85830b66 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
mt25q_qlhs_U_128_ABA_xxT.pdf - Rev. I 05/17 EN 2014 Micron Technology, Inc. All rights reserved.